SCHEMBL15006852

SCHEMBL15006852

CCCCCCCCCCCCCCCCCCC(O)C(=O)NCc1cccc(CNC(=O)C(O)CCCCCCCCCCCCCCCCCC)c1

nearest known ligand 0.49

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
▸ EPHX2 P34913 4/20 0.49
▸ SPHK1 Q9NYA1 1/20 0.46
▸ TRPV1 Q8NER1 2/20 0.45
▸ TLR2 O60603 1/20 0.44
▸ GPR84 Q9NQS5 3/20 0.44
▸ FAAH O00519 1/20 0.44
▸ FFAR1 O14842 1/20 0.44
▸ NAAA Q02083 2/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15006998 1.00 EPHX2 (0.49) EPHX2SPHK1TRPV1TLR2GPR84
SCHEMBL15007033 1.00 EPHX2 (0.49) EPHX2SPHK1TRPV1TLR2GPR84
SCHEMBL15623784 0.82 KMT2A (0.48) —
SCHEMBL424023 0.80 TRPV1 (0.68) EPHX2TRPV1FAAH
SCHEMBL17167961 0.79 SPHK1 (0.57) EPHX2SPHK1
SCHEMBL4425439 0.78 TSHR (0.47) EPHX2SPHK1TLR2
SCHEMBL13933114 0.78 CA1 (0.45) EPHX2
SCHEMBL15007875 0.76 EPHX2 (0.79) EPHX2TRPV1FAAH
SCHEMBL406015 0.76 EPHX2 (0.79) EPHX2TRPV1FAAH
SCHEMBL15008342 0.76 EPHX2 (0.79) EPHX2TRPV1FAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9518168-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-12-13 — — US disclosed
US-9518169-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-12-13 — — US disclosed
US-9376546-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-06-28 — — US disclosed
US-20150225540-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-08-13 — — US disclosed
US-20150197621-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-07-16 — — US disclosed
US-20150197622-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-07-16 — — US disclosed
EP-2604654-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2015-04-15 — — EP disclosed
EP-2604649-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2014-05-14 — — EP disclosed
EP-2604653-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2014-03-19 — — EP disclosed
EP-2604654-A2 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 — — EP disclosed
EP-2604649-A1 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 — — EP disclosed
EP-2604653-A1 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 — — EP disclosed
US-20130150510-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 — — US disclosed
US-20130150506-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 — — US disclosed
US-20130150505-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 — — US disclosed
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