SCHEMBL15045358

SCHEMBL15045358

OCCc1cccc(C(c2cccc(CCO)c2)C(c2cccc(CCO)c2)c2cccc(CCO)c2)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
CYP4F2 P78329 3/20 0.46
CYP4A11 Q02928 3/20 0.46
ACMSD Q8TDX5 1/20 0.44
KDM4E B2RXH2 1/20 0.43
ALDH1A1 P00352 1/20 0.43
ALOX5 P09917 1/20 0.43
GAA P10253 1/20 0.43
MAPT P10636 1/20 0.43
BACE1 P56817 1/20 0.43
CA2 P00918 1/20 0.38
PGK1 P00558 3/20 0.38
PGK2 P07205 3/20 0.38
CYSLTR2 Q9NS75 1/20 0.37
CYSLTR1 Q9Y271 1/20 0.37
SIRT1 Q96EB6 1/20 0.37
CDK8 P49336 1/20 0.36
ENPP2 Q13822 1/20 0.36
MAP4K4 O95819 1/20 0.36
DRD2 P14416 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8507901 0.85 TDP1 (0.48) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL1241139 0.83 TDP1 (0.46) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL23343872 0.83 DAO (0.50) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL26672647 0.82 TDP1 (0.45) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL28037741 0.82 TDP1 (0.45) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL22701304 0.82 TDP1 (0.45) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL239199 0.81 TDP1 (0.65) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL13671664 0.80 CYP4F2 (0.44) TDP1CYP4F2CYP4A11ACMSDKDM4E
SCHEMBL25112424 0.80 CYP4F2 (0.44) TDP1CYP4F2CYP4A11KDM4EALDH1A1
SCHEMBL27809839 0.80 CYP4F2 (0.44) TDP1CYP4F2CYP4A11ACMSDKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8815988-B2 Resin compound, resin composition, and resin-molded product FUJI XEROX CO., LTD. (JP) 2014-08-26 US disclosed
US-20130158173-A1 RESIN COMPOUND, RESIN COMPOSITION, AND RESIN-MOLDED PRODUCT FUJI XEROX CO., LTD. (JP) 2013-06-20 US disclosed