SCHEMBL150618

SCHEMBL150618

CC1CC(C)(C)CC(OOI)(OOC(C)(C)C)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21420 0.92 ESR1 (0.32)
SCHEMBL21267992 0.92 ESR1 (0.32)
SCHEMBL7182565 0.90 ESR1 (0.31)
SCHEMBL11241110 0.87
Tert-Butyl Hydroperoxide SCHEMBL8418848 0.85 ESR1 (0.32)
SCHEMBL13309260 0.85
SCHEMBL10343159 0.83
SCHEMBL370644 0.83
SCHEMBL1110937 0.83
SCHEMBL5909550 0.81 ESR1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11886050-B2 Flexible encapsulated electro-optic media E INK CORPORATION (US) 2024-01-30 US disclosed
EP-3834038-B1 FLEXIBLE ENCAPSULATED ELECTRO-OPTIC MEDIA E INK CORP (US) 2023-10-18 EP disclosed
EP-3834038-A1 FLEXIBLE ENCAPSULATED ELECTRO-OPTIC MEDIA E Ink Corporation (US) 2021-06-16 EP disclosed
WO-2020033176-A1 FLEXIBLE ENCAPSULATED ELECTRO-OPTIC MEDIA E INK CORPORATION (US) 2020-02-13 WO disclosed
US-10272746-B2 Edge-encapsulated panels using high damping foam HENKEL AG & CO. KGAA (DE) 2019-04-30 US disclosed
US-20120055841-A1 EDGE-ENCAPSULATED PANELS USING HIGH DAMPING FOAM HENKEL AG &CO. KGAA (DE) 2012-03-08 US disclosed