Acetaldehyde

Acetaldehyde

SCHEMBL1506844

CC=O.[Sm]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetaldehyde SCHEMBL27375667 0.93 TSHR (1.00)
Acetaldehyde SCHEMBL2338299 0.93
Acetaldehyde SCHEMBL6747 0.93
Acetaldehyde SCHEMBL3945841 0.93
Acetaldehyde SCHEMBL20411618 0.93
Acetaldehyde SCHEMBL1330497 0.93
Acetaldehyde SCHEMBL1331732 0.93
Acetaldehyde SCHEMBL25291303 0.86
Acetaldehyde SCHEMBL2384792 0.86
Acetaldehyde SCHEMBL20658915 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2298714-B1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FERROELECTRIC THIN FILM FORMATION, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD MITSUBISHI MATERIALS CORP (JP) 2017-07-05 EP disclosed
US-9502636-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2016-11-22 US disclosed
US-9005358-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2015-04-14 US disclosed
US-20140349139-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2014-11-27 US disclosed
US-20140349834-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2014-11-27 US disclosed
US-8859051-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-10-14 US disclosed
US-8790538-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-07-29 US disclosed
US-20130295414-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2013-11-07 US disclosed
US-20110177235-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2011-07-21 US disclosed
EP-2343268-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof Mitsubishi Materials Corporation (JP) 2011-07-13 EP disclosed
US-20110098173-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof STMicroelectronics(Tours) SAS (FR) 2011-04-28 US disclosed
EP-2298714-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FERROELECTRIC THIN FILM FORMATION, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD Mitsubishi Materials Corporation (JP) 2011-03-23 EP disclosed