SCHEMBL1585579

SCHEMBL1585579

C=CC(C)(C=C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25437435 0.73
SCHEMBL118888 0.73
SCHEMBL8649763 0.69
SCHEMBL6562478 0.69
SCHEMBL8405469 0.69
SCHEMBL1317592 0.69
SCHEMBL6708064 0.69
SCHEMBL17674999 0.67
SCHEMBL8529166 0.65
SCHEMBL20495981 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20070087025-A1 Reiteratively layered medical devices and method of preparing same FITZHUGH ANTHONY 2007-04-19 US claimed
EP-1436018-A1 NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) 2004-07-14 EP claimed
WO-2003026717-A1 NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) 2003-04-03 WO claimed
EP-4656667-A1 CURABLE COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-03 EP disclosed
US-20250289954-A1 HEAT-CURABLE PERFLUOROPOLYETHER RUBBER COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-18 US disclosed
EP-4516858-A1 HEAT-CURABLE PERFLUOROPOLYETHER RUBBER COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-03-05 EP disclosed
CN-119095913-A Thermosetting perfluoropolyether rubber composition 信越化学工业株式会社 2024-12-06 CN disclosed
WO-2024147260-A1 PERFLUOROPOLYETHER POLYMER-CONTAINING CURABLE COMPOSITION AND ARTICLE 信越化学工業株式会社 2024-07-11 WO disclosed
CN-117148676-A Negative photoresist composition for organic insulating film of liquid crystal display element 烟台希尔德材料科技有限公司 2023-12-01 CN disclosed
EP-3103842-B1 CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW TORAY CO LTD (JP) 2023-01-11 EP disclosed
CN-110088207-B Curable silicone composition and optical semiconductor device using the same 陶氏东丽株式会社 2022-10-14 CN disclosed
EP-1436018-A1 NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) 2004-07-14 EP disclosed
WO-2004012874-A1 CROSS-LINKED NITRIC OXIDE-RELEASING POLYAMINE COATED SUBSTRATES, COMPOSITIONS COMPRISING SAME AND METHOD OF MAKING SAME THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPT. OF HEALTH AND HUMAN SERVICES (US) 2004-02-12 WO disclosed
WO-2003026717-A1 NITRIC OXIDE-RELEASING COATED MEDICAL DEVICES AND METHOD OF PREPARING SAME THE GOVERNMENT OF THE UNITED STATES OF AMERICA, REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) 2003-04-03 WO disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed
US-5252685-A RTV organopolysiloxane compositions for use as cork chip binders and bonded cork chip articles SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-10-12 US disclosed
US-4398010-A CONTAINING PLATINUM SWS SILICONES CORPORATION (US) 1983-08-09 US disclosed