SCHEMBL15915869

SCHEMBL15915869

CCCC[SiH](C1CCCCC1)C1CCCCC1

nearest known ligand 0.44

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.44
NAAA Q02083 2/20 0.32
NOS1 P29475 2/20 0.32
NOS2 P35228 2/20 0.32
EPHX1 P07099 9/20 0.32
SIGMAR1 Q99720 2/20 0.32
SHBG P04278 1/20 0.31
EPHX2 P34913 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15915018 0.98 CYP1A2 (0.41) CYP1A2NAAANOS1NOS2
SCHEMBL15915744 0.91 CYP1A2 (0.41) CYP1A2NAAAEPHX1SIGMAR1EPHX2
SCHEMBL15915197 0.88 CYP1A2 (0.38) CYP1A2NAAAEPHX1SIGMAR1EPHX2
SCHEMBL15914307 0.85 CYP1A2 (0.37) CYP1A2NOS1NOS2SHBG
SCHEMBL15915178 0.82 CYP1A2 (0.33) CYP1A2
SCHEMBL3301595 0.81 CYP1A2 (0.44) CYP1A2NAAANOS1NOS2EPHX1
SCHEMBL28095742 0.79 CYP1A2 (0.48) CYP1A2NAAANOS1NOS2EPHX1
SCHEMBL15915365 0.78 CYP1A2 (0.41) CYP1A2NAAANOS1NOS2
SCHEMBL15915855 0.76 CYP1A2 (0.40) CYP1A2NAAANOS1NOS2
SCHEMBL28290044 0.74 CYP1A2 (0.39) CYP1A2NAAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9970103-B2 Film deposition material, sealing film using the same and use thereof TOSOH CORPORATION (JP) 2018-05-15 US disclosed
US-20160326642-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2016-11-10 US disclosed
US-20140219903-A1 FILM DEPOSITION MATERIAL, SEALING FILM USING THE SAME AND USE THEREOF TOSOH CORPORATION (JP) 2014-08-07 US disclosed
CN-103781937-A Film-forming material, sealing film using same, and use of sealing film TOSOH CORP 2014-05-07 CN disclosed