Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BACE1 | P56817 | 2/20 | 0.56 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.48 |
| ▸ | HPGD | P15428 | 3/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.48 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.48 |
| ▸ | PELI1 | Q96FA3 | 1/20 | 0.45 |
| ▸ | HSD17B1 | P14061 | 1/20 | 0.44 |
| ▸ | HSD17B2 | P37059 | 1/20 | 0.44 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.41 |
| ▸ | MAOA | P21397 | 1/20 | 0.41 |
| ▸ | MAOB | P27338 | 1/20 | 0.41 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.40 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.39 |
| ▸ | MEN1 | O00255 | 3/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.39 |
| ▸ | PTGS2 | P35354 | 2/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | FABP2 | P12104 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30343451 | 1.00 | BACE1 (0.56) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL3161313 | 0.88 | BACE1 (0.47) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL27982622 | 0.85 | BACE1 (0.44) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL30485786 | 0.85 | BACE1 (0.52) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL9007981 | 0.85 | BACE1 (0.52) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL31205973 | 0.85 | BACE1 (0.52) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL1176518 | 0.85 | BACE1 (0.52) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL1596833 | 0.84 | BACE1 (0.60) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL9817000 | 0.84 | BACE1 (0.50) | BACE1ALOX5HPGDALDH1A1HSD17B10 | |
| SCHEMBL28081442 | 0.83 | BACE1 (0.42) | BACE1ALOX5HPGDALDH1A1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-4774367-A | PHENOLIC DYE DEVELOPER | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1988-09-27 | — | — | US | claimed |
| US-12187843-B2 | Liquid compression molding or encapsulant compositions | HENKEL AG & CO. KGAA (DE) | 2025-01-07 | — | — | US | disclosed |
| US-20240301129-A1 | LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY | HENKEL AG & CO KGAA (DE) | 2024-09-12 | — | — | US | disclosed |
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| US-20210163674-A1 | LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS | Henkel IP & Holding GmbH (DE) | 2021-06-03 | — | — | US | disclosed |
| US-10851201-B2 | Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2020-12-01 | — | — | US | disclosed |
| EP-3298061-B1 | A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING | HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) | 2020-09-09 | — | — | EP | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20180142058-A1 | A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2018-05-24 | — | — | US | disclosed |
| CN-107636039-A | Curing agent and the method for preparing insulation system for electronic engineering for thermosetting epoxy resin | 亨斯迈先进材料许可(瑞士)有限公司 | 2018-01-26 | — | — | CN | disclosed |
| EP-0439638-B1 | Heat sensitive recording material | MITSUBISHI PAPER MILLS LTD (JP) | 1995-06-14 | — | — | EP | disclosed |
| US-5364977-A | Chemical stabilization and powder processing | NIPPON SODA CO., LTD. (JP) | 1994-11-15 | — | — | US | disclosed |
| EP-0589044-A1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO., LTD. (JP) | 1994-03-30 | — | — | EP | disclosed |
| US-5246905-A | Aromatic isocyanate, imino compound, fluoran dye | MITSUBISHI PAPER MILLS LIMITED (JP) | 1993-09-21 | — | — | US | disclosed |
| US-5093305-A | Phenolic Compound, Aromatic Isocyanate, Imine | MITSUBISHI PAPER MILLS LIMITED (JP) | 1992-03-03 | — | — | US | disclosed |
| US-5079211-A | Reduced fogging, image storage stability, thermal printing | MITSUBISHI PAPER MILLS LIMITED (JP) | 1992-01-07 | — | — | US | disclosed |
| EP-0439638-A1 | Heat sensitive recording material | MITSUBISHI PAPER MILLS, LTD. (JP) | 1991-08-07 | — | — | EP | disclosed |
| EP-0230961-B1 | PHENOL COMPOUND AND HEAT-SENSITIVE RECORDING MATERIAL | ADEKA ARGUS CHEMICAL CO., Ltd. (JP) | 1990-06-27 | — | — | EP | disclosed |
| US-4774367-A | PHENOLIC DYE DEVELOPER | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1988-09-27 | — | — | US | disclosed |
| EP-0230961-A2 | Phenol compound and heat-sensitive recording material | ADEKA ARGUS CHEMICAL CO., Ltd. (JP) | 1987-08-05 | — | — | EP | disclosed |