SCHEMBL1595740

SCHEMBL1595740

O=C1CC(C2CC3CC2C2C(=O)OC(=O)C32)C(=O)O1

nearest known ligand 0.31

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.31
GMNN O75496 1/20 0.31
PPM1B O75688 1/20 0.31
LMNA P02545 1/20 0.31
PPP1CC P36873 1/20 0.31
TFPI2 P48307 1/20 0.31
RAB9A P51151 1/20 0.31
PPP5C P53041 1/20 0.31
PPP1CA P62136 1/20 0.31
PMP22 Q01453 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
TP53 P04637 1/20 0.31
CYP2D6 P10635 1/20 0.31
NFKB1 P19838 1/20 0.31
THPO P40225 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16405062 0.83 KDM4E (0.33) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL21500160 0.80 KDM4E (0.41) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL22739262 0.78 KDM4E (0.38) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL2140915 0.76 KDM4E (0.34) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL28811373 0.75 KDM4E (0.32) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL18454614 0.74 KDM4E (0.39) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL2139005 0.74 KDM4E (0.42) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10018005 0.73 KDM4E (0.35) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL13515244 0.73 KDM4E (0.32) KDM4EGMNNPPM1BLMNAPPP1CC
SCHEMBL10014683 0.72 KDM4E (0.41) KDM4EGMNNPPM1BLMNAPPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7919550-B2 Encapsulant of epoxy group-containing (meth)acrylic polymer, anhydride and (meth)acrylic monomer SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-04-05 US disclosed
US-20080249220-A1 Encapsulated semiconductor; diodes; crosslinked polymer; photostability; radiation and heat resistance SUMITOMO CHEMICAL COMPANY, LIMITED 2008-10-09 US disclosed
US-7423083-B2 Photosemiconductor encapsulant of epoxy group-containing (meth) acrylic polymer and alicyclic anhydride SUMITOMO CHEMICAL COMPANY LIMITED (JP) 2008-09-09 US disclosed
EP-1426394-A1 RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ENCAPSULATION Sumitomo Chemical Company, Limited (JP) 2004-06-09 EP disclosed
US-20040092668-A1 Encapsulated semiconductor, diodes; crosslinked resin SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-05-13 US disclosed