SCHEMBL15965786

SCHEMBL15965786

CCCCC(CC)CC1(CC(CC)CCCC)c2cc(C)ccc2-c2ccc(-c3ccc(C)c4nsnc34)cc21

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PFKFB3 Q16875 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16016928 0.98 PFKFB3 (0.30) PFKFB3
SCHEMBL5501499 0.85 SMN1; SMN2 (0.31)
SCHEMBL16884885 0.84
SCHEMBL5499782 0.84 SMN1; SMN2 (0.30)
SCHEMBL23252202 0.83 PDK2 (0.32)
SCHEMBL15426047 0.82 CNR1 (0.32)
SCHEMBL16020924 0.82 CNR1 (0.32)
SCHEMBL1108692 0.82 CNR1 (0.32)
SCHEMBL16020923 0.82 CNR1 (0.32)
SCHEMBL23252201 0.82 PDK2 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160013392-A1 METHOD OF PRODUCING THERMOELECTRIC CONVERSION ELEMENT AND METHOD OF PREPARATION DISPERSION FOR THERMOELECTRIC CONVERSION LAYER FUJIFILM CORPORATION (JP) 2016-01-14 US disclosed
US-20140230871-A1 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-08-21 US disclosed