Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 2/20 | 0.58 |
| ▸ | CA2 | P00918 | 2/20 | 0.58 |
| ▸ | CA3 | P07451 | 2/20 | 0.58 |
| ▸ | CA9 | Q16790 | 2/20 | 0.58 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.58 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.58 |
| ▸ | CA1 | P00915 | 1/20 | 0.58 |
| ▸ | GLA | P06280 | 1/20 | 0.58 |
| ▸ | CA4 | P22748 | 1/20 | 0.58 |
| ▸ | MMP3 | P08254 | 1/20 | 0.42 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.42 |
| ▸ | CES2 | O00748 | 1/20 | 0.41 |
| ▸ | CA6 | P23280 | 1/20 | 0.40 |
| ▸ | ESR2 | Q92731 | 3/20 | 0.39 |
| ▸ | ESR1 | P03372 | 3/20 | 0.39 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.37 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | LTA4H | P09960 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenol SCHEMBL27556872 | 0.92 | CA12 (0.61) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL2135047 | 0.92 | CA12 (0.69) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL5792969 | 0.92 | CA12 (0.69) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL3184736 | 0.92 | CA12 (0.69) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL1516384 | 0.92 | CA12 (0.69) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL28110222 | 0.89 | CA12 (0.73) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL28063753 | 0.89 | CA12 (0.73) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL27484833 | 0.87 | CA12 (0.55) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL28458376 | 0.86 | CA12 (0.79) | CA12CA2CA3CA9CA14 | |
| Phenol SCHEMBL28567724 | 0.86 | CA12 (0.79) | CA12CA2CA3CA9CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116218148-A | Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof | 江苏中科科化新材料股份有限公司 | 2023-06-06 | — | — | CN | claimed |
| CN-114149657-B | Epoxy resin composition with low dielectric loss and high CTI (comparative tracking index) and application thereof | 珠海宏昌电子材料有限公司 | 2023-01-17 | — | — | CN | claimed |
| CN-114149657-A | Low dielectric loss and high CTI epoxy resin composition and application thereof | 珠海宏昌电子材料有限公司 | 2022-03-08 | — | — | CN | claimed |
| CN-117586741-A | High Wen Qingsuan-resistant ester conductive adhesive and preparation method thereof | 深圳邦锐特新材料有限公司 | 2024-02-23 | — | — | CN | disclosed |
| CN-116218148-A | Thermosetting resin composition suitable for packaging third-generation semiconductor and preparation method thereof | 江苏中科科化新材料股份有限公司 | 2023-06-06 | — | — | CN | disclosed |
| CN-114149657-B | Epoxy resin composition with low dielectric loss and high CTI (comparative tracking index) and application thereof | 珠海宏昌电子材料有限公司 | 2023-01-17 | — | — | CN | disclosed |
| CN-111849123-B | Epoxy resin composition and application thereof | 常熟生益科技有限公司 | 2022-12-09 | — | — | CN | disclosed |
| CN-114702667-A | Low-dielectric cyanate resin based on intermolecular action and preparation method thereof | 电子科技大学 | 2022-07-05 | — | — | CN | disclosed |
| CN-111849122-B | Resin composition and application thereof | 常熟生益科技有限公司 | 2022-06-14 | — | — | CN | disclosed |
| CN-114149657-A | Low dielectric loss and high CTI epoxy resin composition and application thereof | 珠海宏昌电子材料有限公司 | 2022-03-08 | — | — | CN | disclosed |
| CN-111849122-A | Resin composition and application thereof | 常熟生益科技有限公司 | 2020-10-30 | — | — | CN | disclosed |
| CN-111849123-A | Epoxy resin composition and application thereof | 常熟生益科技有限公司 | 2020-10-30 | — | — | CN | disclosed |
| EP-2770005-B1 | EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME | GUANGDONG SHENGYI SCI TECH CO (CN) | 2019-05-08 | — | — | EP | disclosed |
| US-20140349120-A1 | Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2014-11-27 | — | — | US | disclosed |
| EP-2770005-A1 | EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME | Guangdong Shengyi Sci. Tech Co., Ltd (CN) | 2014-08-27 | — | — | EP | disclosed |