SCHEMBL15966852

SCHEMBL15966852

N#CP(=O)(O)Oc1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
SRC P12931 1/20 0.59
L3MBTL1 Q9Y468 2/20 0.47
TDP1 Q9NUW8 1/20 0.47
CYP2C9 P11712 1/20 0.44
CYP2C19 P33261 1/20 0.44
KDM4E B2RXH2 1/20 0.42
ANPEP P15144 2/20 0.42
LAP3 P28838 2/20 0.42
MEN1 O00255 1/20 0.39
HTT P42858 1/20 0.39
KMT2A Q03164 1/20 0.39
POLB P06746 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27332538 0.81 SRC (0.61) SRCL3MBTL1TDP1CYP2C9CYP2C19
SCHEMBL487130 0.78 SRC (0.52) SRCL3MBTL1TDP1KDM4EMEN1
Water SCHEMBL27693388 0.78 SRC (0.70) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL31108145 0.78 SRC (0.95) SRCL3MBTL1TDP1CYP2C9CYP2C19
Water SCHEMBL7104000 0.78 SRC (0.70) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL28261518 0.78 SRC (0.95) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL28317563 0.76 SRC (0.91) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL9767823 0.76 SRC (0.91) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL27869991 0.76 SRC (0.91) SRCL3MBTL1TDP1CYP2C9CYP2C19
Phenyl Dihydrogen Phosphate SCHEMBL20263 0.75 SRC (1.00) SRCL3MBTL1TDP1CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2770005-B1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME GUANGDONG SHENGYI SCI TECH CO (CN) 2019-05-08 EP claimed
US-20140349120-A1 Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same SHENGYI TECHNOLOGY CO., LTD. (CN) 2014-11-27 US claimed
US-20140342161-A1 Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same Shengyi Technology Co. Ltd. (CN) 2014-11-20 US claimed
EP-2770024-A1 EPOXY RESIN COMPOSITION AND PREPREG AND COPPER CLAD LAMINATE MANUFACTURED BY USING THE SAME Guangdong Shengyi Sci. Tech Co., Ltd (CN) 2014-08-27 EP claimed
EP-2770005-A1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME Guangdong Shengyi Sci. Tech Co., Ltd (CN) 2014-08-27 EP claimed
EP-2770005-B1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME GUANGDONG SHENGYI SCI TECH CO (CN) 2019-05-08 EP disclosed
US-20140349120-A1 Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same SHENGYI TECHNOLOGY CO., LTD. (CN) 2014-11-27 US disclosed
US-20140342161-A1 Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the Same Shengyi Technology Co. Ltd. (CN) 2014-11-20 US disclosed
EP-2770024-A1 EPOXY RESIN COMPOSITION AND PREPREG AND COPPER CLAD LAMINATE MANUFACTURED BY USING THE SAME Guangdong Shengyi Sci. Tech Co., Ltd (CN) 2014-08-27 EP disclosed
EP-2770005-A1 EPOXY RESIN COMPOSITION AND HIGH FREQUENCY ELECTRONIC-CIRCUIT SUBSTRATE MANUFACTURED BY USING THE SAME Guangdong Shengyi Sci. Tech Co., Ltd (CN) 2014-08-27 EP disclosed