SCHEMBL1608308

SCHEMBL1608308

C1=Cc2ccccc2OC1.[Mo].[Ni].[V]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP2B6 P20813 3/20 0.40
STS P08842 1/20 0.39
HTR2C P28335 1/20 0.36
HTR2B P41595 1/20 0.36
ABCG2 Q9UNQ0 1/20 0.36
ITGB2 P05107 1/20 0.36
ICAM1 P05362 1/20 0.36
ITGAL P20701 1/20 0.36
CA1 P00915 1/20 0.33
CA9 Q16790 1/20 0.33
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
ALDH1A1 P00352 1/20 0.32
MAPT P10636 1/20 0.32
KMT2A Q03164 1/20 0.32
LMNA P02545 2/20 0.32
CRHBP P24387 2/20 0.32
CRHR2 Q13324 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
HTT P42858 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28490512 0.98 CYP2B6 (0.41) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL1943718 0.98 CYP2B6 (0.41) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL8996288 0.98 CYP2B6 (0.41) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL30218 0.98 CYP2B6 (0.41) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL4442979 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL6012020 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2
Ammonia Solution, Strong SCHEMBL27990704 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2
Charcoal, Activated SCHEMBL8521238 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL3406847 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2
SCHEMBL28501631 0.96 CYP2B6 (0.40) CYP2B6STSHTR2CHTR2BABCG2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8288011-B2 Adhesiveless copper clad laminates and method for manufacturing thereof SUMITOMO METAL MINING CO., LTD. (JP) 2012-10-16 US claimed
US-20110081557-A1 Adhesiveless copper clad laminates and method for manufacturing thereof NAGATA JUNICHI 2011-04-07 US claimed
US-20080102305-A1 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof SUMITOMO METAL MINING CO., LTD. 2008-05-01 US claimed
US-8288011-B2 Adhesiveless copper clad laminates and method for manufacturing thereof SUMITOMO METAL MINING CO., LTD. (JP) 2012-10-16 US disclosed
US-20110081557-A1 Adhesiveless copper clad laminates and method for manufacturing thereof NAGATA JUNICHI 2011-04-07 US disclosed
US-20080102305-A1 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof SUMITOMO METAL MINING CO., LTD. 2008-05-01 US disclosed