⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1609070 | 0.86 | — | — | |
| SCHEMBL28411953 | 0.85 | — | — | |
| SCHEMBL1607972 | 0.84 | — | — | |
| SCHEMBL28418735 | 0.80 | — | — | |
| SCHEMBL28714181 | 0.79 | — | — | |
| SCHEMBL1608838 | 0.75 | — | — | |
| SCHEMBL28679530 | 0.72 | — | — | |
| SCHEMBL27458675 | 0.70 | TSHR (0.33) | — | |
| SCHEMBL10592233 | 0.70 | CYP4F2 (0.37) | — | |
| SCHEMBL1066711 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12473405-B2 | Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2025-11-18 | — | — | US | disclosed |
| WO-2025053280-A1 | OPTICAL WAVEGUIDE AND OPTICAL MEMBER HAVING OPTICAL WAVEGUIDE | 三菱ケミカル株式会社 | 2025-03-13 | — | — | WO | disclosed |
| WO-2025053279-A1 | ORGANOPOLYSILOXANE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION, CURED PRODUCT THEREOF, ORGANOPOLYSILOXANE FOR NEAR-INFRARED OPTICAL WAVEGUIDE, ORGANOPOLYSILOXANE-CONTAINING RESIN COMPOSITION FOR NEAR-INFRARED OPTICAL WAVEGUIDE, CURED PRODUCT FOR NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL WAVEGUIDE, NEAR-INFRARED OPTICAL TRANSMISSION MEMBER, AND NEAR-INFRARED OPTICAL WAVEGUIDE PRODUCTION METHOD | 三菱ケミカル株式会社 | 2025-03-13 | — | — | WO | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| US-20230250237-A1 | POLYORGANOSILOXANE, POLYORGANOSILOXANE COMPOSITION, CURED PRODUCT, POLYORGANOSILOXANE-CONTAINING ELECTROLYTIC SOLUTION FOR ELECTROLYTIC CAPACITOR, AND ELECTROLYTIC CAPACITOR USING SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-10 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11608415-B2 | Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-03-21 | — | — | US | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| US-20100051582-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2010-03-04 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20090156005-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2009-06-18 | — | — | US | disclosed |
| US-20080318165-A1 | Composition For Forming Antireflective Film And Wiring Forming Method Using Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |
| US-7238462-B2 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-20060241012-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2006-10-26 | — | — | US | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |