⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1608973 | 0.92 | HTT (0.56) | — | |
| SCHEMBL1608644 | 0.92 | TSHR (0.50) | — | |
| SCHEMBL3299011 | 0.89 | TSHR (0.52) | — | |
| SCHEMBL30673 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL8636270 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL1132722 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL988078 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL27130 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL1133315 | 0.85 | TSHR (0.67) | — | |
| SCHEMBL39514 | 0.85 | TSHR (0.67) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105658732-B | The metallic effect pigments being modified with the silylation layer comprising at least two different difunctional silanes | 舒伦克金属颜料有限公司 | 2018-05-04 | — | — | CN | claimed |
| CN-107828059-A | A kind of superhard organic silicon hydrophobic glass resin and preparation method thereof | 湖南七纬科技有限公司 | 2018-03-23 | — | — | CN | claimed |
| CN-107400461-A | A kind of high rigidity dumb light ceramic stain control agent and preparation method thereof | 合众（佛山）化工有限公司 | 2017-11-28 | — | — | CN | claimed |
| EP-0640630-B1 | Aquous dispersion of plastics modified with silicium for the preparation of adhesives | POLYMER LATEX GMBH & CO KG (DE) | 1998-08-12 | — | — | EP | claimed |
| US-12410354-B2 | Heat transfer medium and thermal management system | DENSO CORPORATION (JP) | 2025-09-09 | — | — | US | disclosed |
| US-12148912-B2 | Vehicle thermal management system, heat transfer medium and method for cooling vehicle driving battery | DENSO CORPORATION (JP) | 2024-11-19 | — | — | US | disclosed |
| CN-113365867-B | Heat transfer medium and thermal management system for vehicle | 株式会社电装 | 2024-09-24 | — | — | CN | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20240059088-A1 | SILICA ENCAPSULATED PIGMENTS FOR NANO-METALLOGRAPHY | ECKART GMBH (DE) | 2024-02-22 | — | — | US | disclosed |
| EP-4274741-A1 | SILICA ENCAPSULATED PIGMENTS FOR NANO-METALLOGRAPHY | ECKART GmbH (DE) | 2023-11-15 | — | — | EP | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| US-11718144-B2 | Vehicle thermal management system, heat transfer medium and method for cooling vehicle driving battery | DENSO CORPORATION (JP) | 2023-08-08 | — | — | US | disclosed |
| US-20060241012-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2006-10-26 | — | — | US | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-5580614-A | MIXING SOLUTION OF CHELATED ORGANOMETALLIC COMPOUND HAVING POLYMERIZABLE LIGANDS WITH A HYDROLYZATE OF RADICALLY POLYMERIZED ALKOXYSILANES AND A PHOTOINITIATOR, THEN COATING A SUBSTRATE AND CURING WITH RADIATION | FRAUNHOFER-GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V. (DE) | 1996-12-03 | — | — | US | disclosed |
| US-4060538-A | Process for the preparation of silane esters of tertiary alcohols | DYNAMIT NOBEL AKTIENGESELLSCHAFT (DT) | 1977-11-29 | — | — | US | disclosed |