SCHEMBL16249359

SCHEMBL16249359

COC(C)COC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18023080 1.00
SCHEMBL18023062 1.00
SCHEMBL11045041 0.78 MAPK1 (0.40)
SCHEMBL24495764 0.77
SCHEMBL10060247 0.77 TDP1 (0.32)
SCHEMBL97539 0.77 TDP1 (0.37)
SCHEMBL4905693 0.77 TDP1 (0.37)
SCHEMBL77962 0.77 TDP1 (0.37)
SCHEMBL432060 0.77 TDP1 (0.37)
SCHEMBL28684232 0.77 TDP1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2937918-B1 HINDERED GLYMES FOR ELECTROLYTE COMPOSITIONS FUNDACION CENTRO DE INVESTIG COOPERATIVA DE ENERGIAS ALTERNATIVAS CIC ENERGIGUNE FUNDAZIOA (ES) 2018-10-24 EP claimed
EP-2937918-A1 HINDERED GLYMES FOR ELECTROLYTE COMPOSITIONS CIC Energigune (ES) 2015-10-28 EP claimed
CN-119546740-A Cleaning agent for hard surfaces 轨迹方案IPCO有限责任公司 2025-02-28 CN disclosed
US-11643544-B2 Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-05-09 US disclosed
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN disclosed
CN-108350252-B Epoxy reactive diluent and epoxy resin composition containing same 日产化学工业株式会社 2021-04-09 CN disclosed
CN-110662740-A Method for producing epoxy compound 日产化学株式会社 2020-01-07 CN disclosed
CN-110117404-A Resin combination, and use prepreg, metal foil laminated board and printed circuit board obtained by the composition 台燿科技股份有限公司 2019-08-13 CN disclosed
US-20190241733-A1 RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2019-08-08 US disclosed
CN-108350252-A Epoxy reactive diluent and composition epoxy resin containing it 日产化学工业株式会社 2018-07-31 CN disclosed
EP-2429568-B1 MACROCYCLIC COMPOUNDS AS HEPATITIS C VIRUS INHIBITORS ENANTA PHARM INC (US) 2016-08-17 EP disclosed
EP-2937918-A1 HINDERED GLYMES FOR ELECTROLYTE COMPOSITIONS CIC Energigune (ES) 2015-10-28 EP disclosed
EP-2937918-A1 HINDERED GLYMES FOR ELECTROLYTE COMPOSITIONS CIC Energigune (ES) 2015-10-28 EP disclosed
US-8889704-B2 Triazolopyridine compounds as PIM kinase inhibitors ARRAY BIOPHARMA INC. (US) 2014-11-18 US disclosed
CN-1766733-A Phototonus resin composition, spacer for display panel and display panel JSR CORP (JP) 2006-05-03 CN disclosed