SCHEMBL1626306

SCHEMBL1626306

CCC(C)(C)C(=O)OCCNS(=O)(=O)C(F)(F)F

nearest known ligand 0.44

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.44
CA1 P00915 3/20 0.31
CA2 P00918 3/20 0.31
IDO1 P14902 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18134948 0.91 EPHX1 (0.40) EPHX1CA1CA2
SCHEMBL13557786 0.91 EPHX1 (0.49) EPHX1CA1CA2IDO1
SCHEMBL15697282 0.88 EPHX1 (0.44) EPHX1CA1CA2IDO1
SCHEMBL23963384 0.85 EPHX1 (0.43) EPHX1CA1CA2IDO1
SCHEMBL15697281 0.85 EPHX1 (0.41) EPHX1CA1CA2
SCHEMBL18845082 0.85 EPHX1 (0.41) EPHX1CA1CA2
SCHEMBL10171002 0.85 EPHX1 (0.35) EPHX1
SCHEMBL12616971 0.84 EPHX1 (0.39) EPHX1CA1CA2
SCHEMBL10005955 0.83 EPHX1 (0.39) EPHX1IDO1
SCHEMBL17550348 0.83 EPHX1 (0.39) EPHX1IDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240241440-A1 POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-07-18 US disclosed
US-20240241441-A1 POLYMER, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-07-18 US disclosed
US-11783958-B2 Conductive wiring material composition, conductive wiring substrate and method for producing conductive wiring substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-10 US disclosed
US-11783958-B2 Conductive wiring material composition, conductive wiring substrate and method for producing conductive wiring substrate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-10 US disclosed
US-20230251575-A1 PHOTORESIST TOPCOAT COMPOSITIONS AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2023-08-10 US disclosed
US-20230194986-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-06-22 US disclosed
US-20180180996-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE FUJIFILM CORPORATION (JP) 2018-06-28 US disclosed
US-20180181003-A1 PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LAMINATE FUJIFILM CORPORATION (JP) 2018-06-28 US disclosed
US-20180044459-A1 NON-IONIC ARYL KETONE BASED POLYMERIC PHOTO-ACID GENERATORS CENTRAL GLASS CO., LTD. (JP) 2018-02-15 US disclosed
US-9869933-B2 Pattern trimming methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-01-16 US disclosed
US-7803521-B2 Photoresist compositions and process for multiple exposures with multiple layer photoresist systems INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-09-28 US disclosed
US-20100203445-A1 NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2010-08-12 US disclosed
US-20100168337-A1 GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-07-01 US disclosed
US-7678537-B2 Graded topcoat materials for immersion lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-03-16 US disclosed
US-20090176174-A1 MULTIPLE EXPOSURE PHOTOLITHOGRAPHY METHODS AND PHOTORESIST COMPOSTIONS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-07-09 US disclosed
US-20090136878-A1 TOPCOAT COMPOSITION, ALKALI DEVELOPER-SOLUBLE TOPCOAT FILM USING THE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-05-28 US disclosed
US-20090130590-A1 PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-05-21 US disclosed
US-20090042147-A1 METHOD OF FORMING PATTERNS FUJIFILM CORPORATION (JP) 2009-02-12 US disclosed
US-20080311506-A1 GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY ALLEN ROBERT D 2008-12-18 US disclosed
US-20080311530-A1 GRADED TOPCOAT MATERIALS FOR IMMERSION LITHOGRAPHY INTERNATIONAL BUSINESS MACHINES CORPORATION 2008-12-18 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180044459-A1 NON-IONIC ARYL KETONE BASED POLYMERIC PHOTO-ACID GENERATORS PPARG, PPARA, PPARD EPHX1 1075/4885CA1 4096/4885CA2 4203/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.