SCHEMBL16267686

SCHEMBL16267686

CCC(c1ccc(O)c(C)c1)(c1ccc(O)c(C)c1)c1ccc(O)c(C)c1

nearest known ligand 0.73

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 19/20 0.73
ESR2 Q92731 9/20 0.73
AR P10275 4/20 0.73
TP53 P04637 1/20 0.48
TDP1 Q9NUW8 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL32675852 1.00 ESR1 (0.73) ESR1ESR2ARTP53TDP1
SCHEMBL15961458 0.89 ESR1 (0.69) ESR1ESR2AR
SCHEMBL12004923 0.88 ESR1 (0.65) ESR1ESR2AR
SCHEMBL30058620 0.84 ESR1 (1.00) ESR1ESR2AR
SCHEMBL837374 0.84 ESR1 (1.00) ESR1ESR2AR
SCHEMBL29492899 0.81 ESR1 (0.70) ESR1ESR2ARTP53TDP1
SCHEMBL30596871 0.81 ESR1 (0.70) ESR1ESR2ARTP53TDP1
SCHEMBL29499858 0.81 ESR1 (0.70) ESR1ESR2ARTP53TDP1
SCHEMBL11319965 0.81 ESR1 (0.70) ESR1ESR2ARTP53TDP1
SCHEMBL3850347 0.81 ESR1 (0.70) ESR1ESR2ARTP53TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2818499-B1 RESIN COMPOSITION AND MOLDED BODY OF SAME MITSUBISHI CHEM CORP (JP) 2022-01-12 EP disclosed
CN-104125977-B Resin composition and molded article thereof 三菱化学株式会社 2018-03-06 CN disclosed
US-9193824-B2 Resin composition and molded body of same MITSUBISHI CHEMICAL CORPORATION (JP) 2015-11-24 US disclosed
EP-2818499-A1 RESIN COMPOSITION AND MOLDED BODY OF SAME Mitsubishi Chemical Corporation (JP) 2014-12-31 EP disclosed
US-20140357748-A1 RESIN COMPOSITION AND MOLDED BODY OF SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2014-12-04 US disclosed
CN-104125977-A Resin composition and molded article thereof MITSUBISHI CHEM CORP 2014-10-29 CN disclosed