SCHEMBL1629124

SCHEMBL1629124

CCC(C)(C)C[Si](C)(C)C

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17640450 0.82
SCHEMBL15715734 0.73 TSHR (0.30) TSHRTDP1
SCHEMBL13243456 0.69
SCHEMBL17068807 0.69 TSHR (0.32) TSHRTDP1
SCHEMBL57088 0.69
SCHEMBL14488458 0.67
SCHEMBL9158543 0.67
SCHEMBL17038702 0.66
Ammonia Solution, Strong SCHEMBL8081457 0.65
Ammonia Solution, Strong SCHEMBL11315539 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10031419-B2 Pattern forming method, composition kit and resist film, manufacturing method of electronic device using these, and electronic device FUJIFILM CORPORATION (JP) 2018-07-24 US disclosed
US-20170115568-A1 ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2017-04-27 US disclosed
US-9458343-B2 Method of forming patterns FUJIFILM CORPORATION (JP) 2016-10-04 US disclosed
US-20160195814-A1 PATTERN FORMATION METHOD, ELECTRONIC-DEVICE PRODUCTION METHOD, AND PROCESSING AGENT FUJIFILM CORPORATION (JP) 2016-07-07 US disclosed
US-20160048075-A1 PATTERN FORMING METHOD, COMPOSITION KIT AND RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THESE, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2016-02-18 US disclosed
US-20160009936-A1 METHOD OF FORMING PATTERNS FUJIFILM CORPORATION (JP) 2016-01-14 US disclosed
US-9176386-B2 Method of forming patterns FUJIFILM CORPORATION (JP) 2015-11-03 US disclosed
US-9122151-B2 Resist composition, resist film therefrom and method of forming negative pattern using the composition FUJIFILM CORPORATION (JP) 2015-09-01 US disclosed
US-9046766-B2 Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same FUJIFILM CORPORATION (JP) 2015-06-02 US disclosed
US-9012123-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2015-04-21 US disclosed
US-7611820-B2 Positive resist composition and pattern-forming method using the same FUJIFILM CORPORATION (JP) 2009-11-03 US disclosed
US-20090123880-A1 PATTERN FORMING METHOD FUJIFILM CORPORATION (JP) 2009-05-14 US disclosed
US-20090042147-A1 METHOD OF FORMING PATTERNS FUJIFILM CORPORATION (JP) 2009-02-12 US disclosed
US-7482112-B2 Pattern forming method FUJIFILM CORPORATION (JP) 2009-01-27 US disclosed
US-7368220-B2 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2008-05-06 US disclosed
US-20080081290-A1 RESIST COMPOSITION, RESIN FOR USE IN THE RESIST COMPOSITION, COMPOUND FOR USE IN THE SYNTHESIS OF THE RESIN, AND PATTERN-FORMING METHOD USING THE RESIST COMPOSITION FUJIFILM CORPORATION (JP) 2008-04-03 US disclosed
US-20070172768-A1 Pattern forming method FUJIFILM CORPORATION (JP) 2007-07-26 US disclosed
US-20070148589-A1 Positive resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2007-06-28 US disclosed
US-20070059639-A1 Positive resist composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. 2007-03-15 US disclosed
US-7189492-B2 Photosensitive composition and pattern forming method using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-03-13 US disclosed