SCHEMBL1635565

SCHEMBL1635565

O=C(O)c1cccc(Oc2cccc(Oc3cccc(C(=O)O)c3)c2)c1

nearest known ligand 0.88

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.88
KMO O15229 1/20 0.71
KDM4E B2RXH2 1/20 0.65
MRGPRX4 Q96LA9 1/20 0.60
NPC1 O15118 2/20 0.59
POLB P06746 1/20 0.59
CYP2C9 P11712 1/20 0.59
RAB9A P51151 1/20 0.59
HDAC8 Q9BY41 1/20 0.59
KMT2A Q03164 1/20 0.58
NR4A2 P43354 1/20 0.58
TNKS O95271 1/20 0.56
PARP15 Q460N3 1/20 0.56
PARP14 Q460N5 1/20 0.56
PARP10 Q53GL7 1/20 0.56
TNKS2 Q9H2K2 1/20 0.56
PARP2 Q9UGN5 1/20 0.56
ERCC5 P28715 1/20 0.54
FEN1 P39748 1/20 0.54
F2 P00734 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30266792 1.00 AKR1C3 (0.88) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL30449599 0.98 AKR1C3 (0.92) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL68858 0.98 AKR1C3 (0.92) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL30307454 0.98 AKR1C3 (0.92) AKR1C3KMOKDM4EMRGPRX4NPC1
M-Phenoxybenzoic Acid For Cis-Isomer SCHEMBL30445868 0.94 AKR1C3 (1.00) AKR1C3KMOKDM4EMRGPRX4NPC1
M-Phenoxybenzoic Acid For Cis-Isomer SCHEMBL29522837 0.94 AKR1C3 (1.00) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL30266789 0.94 AKR1C3 (0.92) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL1042631 0.94 AKR1C3 (0.92) AKR1C3KMOKDM4EMRGPRX4NPC1
M-Phenoxybenzoic Acid For Cis-Isomer SCHEMBL128732 0.94 AKR1C3 (1.00) AKR1C3KMOKDM4EMRGPRX4NPC1
SCHEMBL16429487 0.92 AKR1C3 (0.82) AKR1C3KMOKDM4EMRGPRX4NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250199401-A1 RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2025-06-19 US disclosed
US-20230323030-A1 Polyamide, Polyamide-Imide, Derivatives of These, Optical Film, Display Device, and Production Methods Therefor CENTRAL GLASS COMPANY, LIMITED (JP) 2023-10-12 US disclosed
WO-2023182071-A1 RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND DISPLAY DEVICE 東レ株式会社 2023-09-28 WO disclosed
US-20230303480-A1 Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-28 US disclosed
US-20230287178-A1 Fluorinated Diamine or Salt Thereof, Method for Producing Fluorinated Diamine or Salt Thereof, Polyamide, Method for Producing Polyamide, Polyamide Solution, Cyclized Polyamide, Method for Producing Cyclized Polyamide, Insulation for High-Frequency Electronic Component, Method for Producing Insulation for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Appliance, and Insulating Material for Producing High-Frequency Electronic Component CENTRAL GLASS COMPANY, LIMITED (JP) 2023-09-14 US disclosed
EP-4194482-A1 POLYBENZOXAZOLE, POLYAMIDE, POLYAMIDE SOLUTION, INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY EQUIPMENT, INSULATION MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING POLYAMIDE, METHOD FOR PRODUCING POLYBENZOXAZOLE, METHOD FOR PRODUCING INSULATION FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, AND DIAMINE OR SALT THEREOF Central Glass Company, Limited (JP) 2023-06-14 EP disclosed
EP-4190768-A1 FLUORINATED DIAMINE OR SALT THEREOF, METHOD FOR PRODUCING FLUORINATED DIAMINE OR SALT THEREOF, POLYAMIDE, METHOD FOR PRODUCING POLYAMIDE, POLYAMIDE SOLUTION, CYCLIZED POLYAMIDE, METHOD FOR PRODUCING CYCLIZED POLYAMIDE, INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, METHOD FOR PRODUCING INSULATING MATERIAL FOR HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY ELECTRONIC COMPONENT, HIGH-FREQUENCY APPLIANCE, AND INSULATING MATERIAL FOR PRODUCING HIGH-FREQUENCY ELECTRONIC COMPONENT Central Glass Company, Limited (JP) 2023-06-07 EP disclosed
EP-4163319-A1 POLYAMIDE, POLYAMIDE-IMIDE, DERIVATIVES OF THESE, OPTICAL FILM, DISPLAY DEVICE, AND PRODUCTION METHODS THEREFOR Central Glass Company, Limited (JP) 2023-04-12 EP disclosed
US-10457780-B2 Hygromorphic polymers and copolymers having humidity-driven motility UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 2019-10-29 US disclosed
US-10087284-B2 Fluorine-containing polymerizable monomer and polymer compound using same CENTRAL GLASS COMPANY, LIMITED (JP) 2018-10-02 US disclosed
EP-1698460-A1 MULTILAYER BODY TEIJIN LIMITED (JP) 2006-09-06 EP disclosed
US-20060134407-A1 Adhesive sheet and layered product TEIJIN LIMITED (JP) 2006-06-22 US disclosed
US-20050249961-A1 Polybenzazole precursor film, polybenzazole film and method of producing the same POLYMATECH CO., LTD. (JP) 2005-11-10 US disclosed
EP-1589086-A1 ADHESIVE SHEET AND LAYERED PRODUCT TEIJIN LIMITED (JP) 2005-10-26 EP disclosed
EP-1557440-A1 Article formed of polybenzazole and production method for the same Polymatech Co., Ltd. (JP) 2005-07-27 EP disclosed
US-20050156356-A1 Article formed of polybenzazole and production method for the same POLYMATECH CO., LTD 2005-07-21 US disclosed
EP-1384743-A1 Polybenzazole precursor film, polybenzazole film and method of producing the same Polymatech Co., Ltd. (JP) 2004-01-28 EP disclosed
US-6384182-B2 REACTING A DICARBOXYLIC ACID WITH A BIS(AMINOPHENOL) TO FORM A POLYHYDROXYAMIDE FOLLOWED BY CYCLIZATION; USEFUL AS INSULATING AND COATING MATERIALS CENTRAL GLASS COMPANY, LIMITED (JP) 2002-05-07 US disclosed
US-20010051705-A1 Fluorine-containing polybenzoxazole CENTRAL GLASS COMPANY, LIMITED 2001-12-13 US disclosed
US-6291635-B1 LOW DIELECTRIC CONSTANT AND LOW COEFFICIENT OF THERMAL EXPANSION CENTRAL GLASS COMPANY, LIMITED (JP) 2001-09-18 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20230303480-A1 Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof PUF60, TET1, PBRM1 AKR1C3 3017/4885KMO 1785/4885KDM4E 1909/4885
US-10457780-B2 Hygromorphic polymers and copolymers having humidity-driven motility DNAH12, PARG, PARN AKR1C3 4603/4885KMO 3724/4885KDM4E 4172/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.