⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4087092 | 0.67 | — | — | |
| SCHEMBL28152 | 0.64 | — | — | |
| SCHEMBL28138929 | 0.64 | — | — | |
| SCHEMBL28306647 | 0.64 | — | — | |
| SCHEMBL28198281 | 0.64 | — | — | |
| SCHEMBL804760 | 0.61 | — | — | |
| SCHEMBL16002450 | 0.61 | — | — | |
| SCHEMBL2798310 | 0.61 | — | — | |
| SCHEMBL5412431 | 0.61 | — | — | |
| SCHEMBL6545709 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024063044-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-03-28 | — | — | WO | disclosed |
| WO-2024019064-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| WO-2024009993-A1 | METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023157943-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | 日産化学株式会社 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023136250-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-07-20 | — | — | WO | disclosed |
| WO-2023037979-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, MULTILAYER BODY USING SAID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023008507-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-02-02 | — | — | WO | disclosed |
| WO-2022260154-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-12-15 | — | — | WO | disclosed |
| WO-2022230940-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-11-03 | — | — | WO | disclosed |
| WO-2022210954-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| CN-110573536-A | Catalyst for olefin polymerization, process for producing olefin polymer, and propylene-alpha-olefin copolymer | 东邦钛株式会社 | 2019-12-13 | — | — | CN | disclosed |
| CN-110494807-A | The resist lower membrane formation composition containing silicon with carbonyl structure | NISSAN CHEMICAL CORP | 2019-11-22 | — | — | CN | disclosed |
| CN-107077072-A | It is capable of the resist lower membrane formation composition containing silicon of wet type removing | 日产化学工业株式会社 | 2017-08-18 | — | — | CN | disclosed |
| CN-103748517-B | Silicon-containing resist underlayer film-forming composition having sulfone structure | 日产化学工业株式会社 | 2017-04-19 | — | — | CN | disclosed |
| EP-1391476-B1 | PHOTOREACTIVE COMPOSITION | SEKISUI CHEMICAL CO LTD (JP) | 2015-12-09 | — | — | EP | disclosed |
| US-8536242-B2 | Photocurable composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2013-09-17 | — | — | US | disclosed |
| US-20110097669-A1 | PHOTOCURABLE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2011-04-28 | — | — | US | disclosed |
| US-7312013-B2 | Photoreactive composition | SEKISUI CHEMICAL CO., LTD. (JP) | 2007-12-25 | — | — | US | disclosed |
| US-20040202956-A1 | a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-10-14 | — | — | US | disclosed |
| EP-1391476-A1 | PHOTOREACTIVE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-02-25 | — | — | EP | disclosed |