SCHEMBL1647636

SCHEMBL1647636

CC(N)C1CCNC1.CO[SiH](OC)OC

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 10/20 0.34
SLC6A4 P31645 10/20 0.34
SLC6A3 Q01959 6/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17766169 0.89 CPN1 (0.35)
SCHEMBL17766125 0.88 CPN1 (0.31)
SCHEMBL19638539 0.86 CPN1 (0.30)
SCHEMBL4183259 0.86 CPN1 (0.30)
SCHEMBL19638518 0.86 CPN1 (0.30)
SCHEMBL19638523 0.86 CPN1 (0.30)
SCHEMBL19638514 0.86 CPN1 (0.30)
SCHEMBL19638542 0.86 CPN1 (0.30)
SCHEMBL15463365 0.86 CPN1 (0.30)
SCHEMBL8326319 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111648038-A Melt-blown cloth and application thereof in protective mask 升欣(上海)纺织品科技有限公司 2020-09-11 CN claimed
CN-112175565-B Moisture-curable resin composition and cured product 三键有限公司 2024-07-02 CN disclosed
US-12013288-B2 Bolometer and method for manufacturing same NEC CORPORATION (JP) 2024-06-18 US disclosed
WO-2024122103-A1 ETCHING SOLUTION COMPOSITION ラサ工業株式会社 2024-06-13 WO disclosed
US-20240094649-A1 ELECTROPHOTOGRAPHIC PHOTOCONDUCTOR, METHOD OF MANUFACTURING THE SAME, AND ELECTROPHOTOGRAPHIC APPARATUS FUJI ELECTRIC CO., LTD. (JP) 2024-03-21 US disclosed
EP-3279373-B1 SILICONE-MODIFIED POLYURETHANE-BASED FIBER AND METHOD FOR MANUFACTURING SAME SHINETSU CHEMICAL CO (JP) 2024-03-06 EP disclosed
US-11879077-B2 Thermally conductive moisture-curable resin composition and cured product thereof THREEBOND CO., LTD. (JP) 2024-01-23 US disclosed
US-20240011841-A1 BOLOMETER USING CARBON NANOTUBES NEC CORPORATION (JP) 2024-01-11 US disclosed
US-20230408340-A1 METHOD FOR MANUFACTURING BOLOMETER NEC CORPORATION (JP) 2023-12-21 US disclosed
CN-117157139-A Organic solvent dispersion containing colloidal silica particles and zinc cyanurate particles, and process for producing the same 日产化学株式会社 2023-12-01 CN disclosed
WO-2012097836-A1 POLYMERIZABLE COMPOSITIONS, CURED PRODUCTS OBTAINED THEREWITH, AND USE OF THESE MATERIALS FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER... (DE) 2012-07-26 WO disclosed
US-20110165425-A1 INTERMEDIATE FILM FOR LAMINATED GLASS, METHOD FOR PRODUCING INTERMEDIATE FILM FOR LAMINATED GLASS, AND LAMINATED GLASS SEKISUI CHEMICAL CO., LTD. (JP) 2011-07-07 US disclosed
US-20110088933-A1 LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE HITACHI, LTD. (JP) 2011-04-21 US disclosed
US-6573321-B2 Polyol compound with a polyisocyanate compound and a tetraalkoxylsilane condensate; finishes for building structures and bridges SK KAKEN CO., LTD. (JP) 2003-06-03 US disclosed
US-6384254-B1 ANTIMICROBIAL; SOFTNESS; WEAR RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-05-07 US disclosed
US-6271293-B1 Non-staining coating composition SK KAKEN CO., LTD. (JP) 2001-08-07 US disclosed
EP-0245883-B1 POLYESTER FILM FOR MAGNETIC RECORDING MEDIUM TORAY INDUSTRIES, INC. (JP) 1992-10-28 EP disclosed
EP-0245883-A2 Polyester film for magnetic recording medium TORAY INDUSTRIES, INC. (JP) 1987-11-19 EP disclosed
US-4548855-A WATER SOLUBLE POLYMER AND FINE PARTICLES TORAY INDUSTRIES, INC. (JP) 1985-10-22 US disclosed
EP-0108593-A1 Polyester film for magnetic recording medium TORAY INDUSTRIES, INC. (JP) 1984-05-16 EP disclosed