SCHEMBL16488172

SCHEMBL16488172

C[PH](C1=CC=CCC1)(c1ccccc1)c1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17173319 0.82
SCHEMBL21677140 0.81
SCHEMBL22201596 0.73
SCHEMBL14781550 0.73
SCHEMBL16362455 0.73
SCHEMBL23442272 0.71
SCHEMBL19077694 0.71
SCHEMBL21167254 0.71
SCHEMBL21156490 0.70
SCHEMBL27822071 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230333472-A1 THERMOSETTING IODINE- AND SILICON-CONTAINING MATERIAL, COMPOSITION CONTAINING THE MATERIAL FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY, AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-19 US disclosed
US-20230111768-A1 METHOD FOR SYNTHESIZING AN ANTI-CANCER COMPOUND THROUGH A ONE-POT REACTION Batooie, Nasim (IR) 2023-04-13 US disclosed
US-9633922-B2 Sealing epoxy resin composition, hardened product, and semiconductor device PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2017-04-25 US disclosed
US-9633922-B2 Sealing epoxy resin composition, hardened product, and semiconductor device PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2017-04-25 US disclosed
US-20160260645-A1 SEALING EPOXY RESIN COMPOSITION, HARDENED PRODUCT, AND SEMICONDUCTOR DEVICE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2016-09-08 US disclosed
EP-2837671-A2 Liquid crystalline medium Merck Patent GmbH (DE) 2015-02-18 EP disclosed