SCHEMBL16496992

SCHEMBL16496992

CC[Si](CC)(CC(C)C)CC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16496814 0.93
SCHEMBL15862528 0.93
SCHEMBL11502039 0.82
SCHEMBL3900028 0.81 TSHR (0.33)
SCHEMBL16497570 0.73
SCHEMBL16497357 0.73
SCHEMBL16497178 0.73
SCHEMBL16496993 0.69 TSHR (0.32)
SCHEMBL16497029 0.69 TSHR (0.32)
SCHEMBL16497564 0.69 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240173235-A1 PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS MOMENTIVE PERFORMANCE MATERIALS INC. 2024-05-30 US disclosed
EP-4322915-A1 PERSONAL CARE COMPOSITIONS COMPRISING SILAHYDROCARBONS Momentive Performance Materials Inc. (US) 2024-02-21 EP disclosed
CN-102308020-A Insulating film material, and film formation method utilizing the material, and insulating film NAT INST FOR MATERIAL SCIENCE 2012-01-04 CN disclosed
US-20110313184-A1 INSULATING FILM MATERIAL, AND FILM FORMATION METHOD UTILIZING THE MATERIAL, AND INSULATING FILM TAIYO NIPPON SANSO CORPORATION (JP) 2011-12-22 US disclosed