⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2494019 | 1.00 | — | — | |
| SCHEMBL9780552 | 0.75 | — | — | |
| SCHEMBL691714 | 0.75 | — | — | |
| SCHEMBL5576203 | 0.75 | — | — | |
| SCHEMBL5576194 | 0.75 | — | — | |
| SCHEMBL14859287 | 0.72 | — | — | |
| SCHEMBL14859286 | 0.72 | — | — | |
| SCHEMBL21051746 | 0.69 | — | — | |
| SCHEMBL21051670 | 0.68 | TSHR (0.31) | — | |
| SCHEMBL14859786 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 127 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11214651-B2 | Thermally conductive silicone composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-01-04 | — | — | US | claimed |
| US-20210324148-A1 | THERMALLY CONDUCTIVE SILICONE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-21 | — | — | US | claimed |
| CN-109563348-B | Heat conductive silicone composition | 信越化学工业株式会社 | 2021-10-15 | — | — | CN | claimed |
| EP-3156456-B1 | ONE-PART ADDITION-CURING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2021-01-20 | — | — | EP | claimed |
| EP-3199591-B1 | UV-THICKENING THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2020-04-29 | — | — | EP | claimed |
| US-20190085167-A1 | ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2019-03-21 | — | — | US | claimed |
| EP-3431553-A1 | ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF | Shin-Etsu Chemical Co., Ltd. (JP) | 2019-01-23 | — | — | EP | claimed |
| US-10030184-B2 | Addition one part curing type heat-conductive silicone grease composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-07-24 | — | — | US | claimed |
| US-20170313924-A1 | ULTRAVIOLET-THICKENABLE THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-11-02 | — | — | US | claimed |
| US-20170283677-A1 | UV-THICKENING THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-10-05 | — | — | US | claimed |
| US-20170101570-A1 | ADDITION ONE PART CURING TYPE HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2017-04-13 | — | — | US | claimed |
| EP-3059284-A1 | ULTRAVIOLET-RAY-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND METHOD FOR PRODUCING PRINTING MATERIAL | Shin-Etsu Chemical Co., Ltd. (JP) | 2016-08-24 | — | — | EP | claimed |
| US-20160230005-A1 | ULTRAVIOLET-RAY-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND METHOD FOR PRODUCING PRINTING MATERIAL | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-08-11 | — | — | US | claimed |
| US-9365757-B2 | UV-curable adhesive organopolysiloxane composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2016-06-14 | — | — | US | claimed |
| US-20150124338-A1 | UV-CURABLE ADHESIVE ORGANOPOLYSILOXANE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-05-07 | — | — | US | claimed |
| US-8952077-B2 | Silicone rubber composition, silicone rubber molded article, and production method thereof | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2015-02-10 | — | — | US | claimed |
| US-20140135416-A1 | SILICONE RUBBER COMPOSITION, SILICONE RUBBER MOLDED ARTICLE, AND PRODUCTION METHOD THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2014-05-15 | — | — | US | claimed |
| EP-2584003-A1 | Method for Curing Addition Curable Organopolysiloxane Composition | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-04-24 | — | — | EP | claimed |
| US-20130096223-A1 | METHOD FOR CURING ADDITION CURABLE ORGANOPOLYSILOXANE COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-04-18 | — | — | US | claimed |
| US-20050081907-A1 | Electro-active device having metal-containing layer | GENERAL ELECTRIC COMPANY | 2005-04-21 | — | — | US | claimed |