SCHEMBL1658619

SCHEMBL1658619

CC1CCC=C(O)C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10268906 0.78
SCHEMBL1658305 0.74
SCHEMBL8025223 0.72
SCHEMBL716158 0.72
SCHEMBL8989796 0.72
SCHEMBL6593973 0.70
SCHEMBL13090833 0.70
SCHEMBL16217230 0.70
SCHEMBL13090810 0.70
SCHEMBL10454392 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113135705-A High-impermeability anti-cracking concrete and preparation process thereof 浙江华滋奔腾建材有限公司 2021-07-20 CN claimed
EP-0465912-A2 Gas and vapor barrier polyolefinic films Moplefan S.p.A. (IT) 1992-01-15 EP claimed
JP-3055755-A None JP disclosed
EP-4746003-A1 COMPOUND, VARNISH, BOND MAGNET, AND MOTOR Asahi Kasei Kabushiki Kaisha (JP) 2026-05-20 EP disclosed
CN-119998352-A Epoxy resin curing agent, epoxy resin composition, sealing material, electrically conductive material, thermally conductive material, adhesive for camera module, adhesive for structure, matrix resin for fiber-reinforced plastic, impregnating and fixing material, interlayer insulating film, film-type solder resist, sealing sheet, electrically conductive film, anisotropic electrically conductive film, thermally conductive film, and method for producing dyed cured product 旭化成株式会社 2025-05-13 CN disclosed
WO-2025069598-A1 EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, SEALING MATERIAL, CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, ADHESIVE FOR CAMERA MODULES, ADHESIVE FOR STRUCTURES, MATRIX RESIN FOR FIBER-REINFORCED PLASTICS, IMPREGNATED FIXING MATERIAL, INTERLAYER INSULATING FILM, FILM-TYPE SOLDER RESIST, SEALING SHEET, CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, THERMALLY CONDUCTIVE FILM, AND METHOD FOR PRODUCING DYED CURED PRODUCT 旭化成株式会社 2025-04-03 WO disclosed
WO-2025013940-A1 COMPOUND, VARNISH, BOND MAGNET, AND MOTOR 旭化成株式会社 2025-01-16 WO disclosed
US-20240376291-A1 EPOXY RESIN COMPOSITION, FILM, METHOD FOR PRODUCING FILM, AND CURED PRODUCTS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-11-14 US disclosed
CN-117580888-A Epoxy resin composition, film, method for producing film, and cured product 旭化成株式会社 2024-02-20 CN disclosed
CN-117186671-A High-dispersibility modified carbon black and preparation method thereof 江南大学 2023-12-08 CN disclosed
WO-2023286499-A1 EPOXY RESIN COMPOSITION, FILM, FILM PRODUCTION METHOD, AND CURED PRODUCT 旭化成株式会社 2023-01-19 WO disclosed
US-8377458-B2 Cooling sensation agent composition, sensory stimulation agent composition and use of the same TAKASAGO INTERNATIONAL CORPORATION (JP) 2013-02-19 US disclosed
US-20110117147-A1 COOLING SENSATION AGENT COMPOSITION AND SENSORY STIMULATION AGENT COMPOSITION TAKASAGO INTERNATIONAL CORPORATION (JP) 2011-05-19 US disclosed
US-20110081393-A1 COOLING SENSATION AGENT COMPOSITION, SENSORY STIMULATION AGENT COMPOSITION AND USE OF THE SAME TAKASAGO INTERNATIONAL CORPORATION 2011-04-07 US disclosed
WO-2010123139-A1 ARYLCARBOXAMIDE DERIVATIVE HAVING SULFAMOYL GROUP 持田製薬株式会社 (JP) 2010-10-28 WO disclosed
WO-2009123355-A2 COOLING SENSATION AGENT COMPOSITION AND SENSORY STIMULATION AGENT COMPOSITION TAKASAGO INTERNATIONAL CORPORATION (JP) 2009-10-08 WO disclosed
WO-2001053084-A1 TRANSPARENT, BIAXIALLY ORIENTED, UV-STABILIZED, SEALABLE FILM, PRODUCTION METHOD AND UTILIZATION THEREOF MITSUBISHI POLYESTER FILM GMBH (DE) 2001-07-26 WO disclosed
EP-0465912-A2 Gas and vapor barrier polyolefinic films Moplefan S.p.A. (IT) 1992-01-15 EP disclosed
JP-H0355755-A ALKALI BATTERY SEPARATOR KANAI HIROYUKI 1991-03-11 JP disclosed
US-4572854-A SAPONIFIED ETHYLEBNE-VINYL ACETATE AND OLEFIN POLYMER LAYERS HOECHST AKTIENGESELLSCHAFT (DE) 1986-02-25 US disclosed