SCHEMBL1660254

SCHEMBL1660254

[CH2]COC1CC2CC1C1CCCC21

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.49
CA12 O43570 2/20 0.49
GMNN O75496 2/20 0.49
ALDH1A1 P00352 2/20 0.49
CA1 P00915 2/20 0.49
CA2 P00918 2/20 0.49
LMNA P02545 2/20 0.49
BLM P54132 2/20 0.49
CA9 Q16790 2/20 0.49
TDP1 Q9NUW8 2/20 0.49
SGMS1 Q86VZ5 1/20 0.49
SGMS2 Q8NHU3 1/20 0.49
KDM4E B2RXH2 1/20 0.47
MEN1 O00255 1/20 0.47
TP53 P04637 1/20 0.47
CYP3A4 P08684 1/20 0.47
CYP2C9 P11712 1/20 0.47
ALOX15 P16050 1/20 0.47
TSHR P16473 1/20 0.47
ALOX12 P18054 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1660821 0.82 MAPT (0.44) MAPTCA12GMNNALDH1A1CA1
SCHEMBL21755813 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL21755808 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL21755809 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL16684207 0.80 MAPT (0.53) MAPTCA12GMNNALDH1A1CA1
SCHEMBL21755810 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL21755812 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL11965852 0.80 MAPT (0.49) MAPTCA12GMNNALDH1A1CA1
SCHEMBL1658790 0.79 MAPT (0.41) MAPTCA12GMNNALDH1A1CA1
SCHEMBL14175464 0.77 MAPT (0.46) MAPTCA12GMNNALDH1A1CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3345970-B1 RESIN COMPOSITION ZEON CORP (JP) 2021-07-28 EP disclosed
US-10833272-B2 Laminate and kit FUJIFILM CORPORATION (JP) 2020-11-10 US disclosed
US-10775697-B2 Radiation-sensitive resin composition, resin film, and electronic device ZEON CORPORATION (JP) 2020-09-15 US disclosed
US-10446690-B2 Method of production of semiconductor device TOHOKU UNIVERSITY (JP) 2019-10-15 US disclosed
US-10439139-B2 2019-10-08 US disclosed
EP-3121652-B1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT ZEON CORP (JP) 2019-09-04 EP disclosed
EP-3121651-B1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT ZEON CORP (JP) 2019-05-15 EP disclosed
US-10254648-B2 Radiation-sensitive resin composition, resin film, and electronic device ZEON CORPORTION (JP) 2019-04-09 US disclosed
US-10233325-B2 Resin composition ZEON CORPORATION (JP) 2019-03-19 US disclosed
US-20180273722-A1 RESIN COMPOSITION ZEON CORPORATION (JP) 2018-09-27 US disclosed
US-20160209744-A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2016-07-21 US disclosed
US-20160200914-A1 RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2016-07-14 US disclosed
EP-3037880-A1 LAMINATE BODY Fujifilm Corporation (JP) 2016-06-29 EP disclosed
US-20160170303-A1 LAMINATE BODY FUJIFILM CORPORATION (JP) 2016-06-16 US disclosed
US-20140154627-A1 NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORPORATION (JP) 2014-06-05 US disclosed
US-20140087136-A1 RESIN COMPOSITION AND SEMICONDUCTOR DEVICE BOARD ZEON CORPORATION (JP) 2014-03-27 US disclosed
US-8084545-B2 Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2011-12-27 US disclosed
EP-2308905-A1 CURABLE COPOLYMER AND CURABLE RESIN COMPOSITION Daicel Chemical Industries, Ltd. (JP) 2011-04-13 EP disclosed
US-20100137515-A1 PHOTO- AND/OR THERMO-CURABLE COPOLYMER, CURABLE RESIN COMPOSITIONS, AND CURED ARTICLES DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-06-03 US disclosed
EP-2147937-A1 PHOTO- AND/OR THERMO-CURABLE COPOLYMER, CURABLE RESIN COMPOSITIONS, AND CURED ARTICLES Daicel Chemical Industries, Ltd. (JP) 2010-01-27 EP disclosed