SCHEMBL1660274

SCHEMBL1660274

C=CN(C=C)C=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL1660885 0.94
SCHEMBL4933531 0.66
SCHEMBL152040 0.59
SCHEMBL34460004 0.58
Ammonia Solution, Strong SCHEMBL11331271 0.56
Ammonia Solution, Strong SCHEMBL4446041 0.56
Ethylene SCHEMBL11441607 0.56
Butadiene SCHEMBL11300883 0.50
SCHEMBL22022973 0.50
SCHEMBL11149322 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118185268-B Flame-retardant low-viscosity photo-curing BMC composite material and preparation method thereof 江西广源化工有限责任公司 2025-05-23 CN claimed
CN-119307962-A Ru@Ni2P-Ni3Preparation method of P core-shell structure catalyst, PEM membrane electrode and preparation method thereof 天际装备科技(苏州)有限公司 2025-01-14 CN claimed
CN-118185268-A Flame-retardant low-viscosity photo-curing BMC composite material and preparation method thereof 江西广源化工有限责任公司 2024-06-14 CN claimed
CN-117363299-B Hot melt adhesive and preparation method thereof 广东合力化工科技有限公司 2024-04-30 CN claimed
CN-115124964-B Moisture-curing polyurethane hot melt adhesive and preparation method and application thereof 北京长润化工有限公司 2024-03-26 CN claimed
CN-114573946-B Halogen-free low dielectric epoxy resin composition, laminated board and printed circuit board 联茂(无锡)电子科技有限公司 2024-03-08 CN claimed
CN-117363299-A Hot melt adhesive and preparation method thereof 东莞市皓彩塑胶科技有限公司 2024-01-09 CN claimed
CN-115448642-A Asphalt cold-patch material and preparation method thereof 上海科妥建设工程咨询合伙企业(有限合伙) 2022-12-09 CN claimed
US-20140004266-A1 METHOD FOR COATING SURFACES AND USE OF THE OBJECTS COATED USING SAID METHOD CHEMETALL GMBH (DE) 2014-01-02 US claimed
US-8193261-B2 Halogen-free flame retarding masterbatch with low phosphorous content, composition and process for preparing the same and flame retarding article containing the same TAIWAN TEXTILE RESEARCH INSTITUTE (TW) 2012-06-05 US claimed
US-20110098379-A1 Halogen-Free Flame Retarding Masterbatch with Low Phosphorous Content, Composition and Process for Preparing the Same and Flame Retarding Article Containing the Same TAIWAN TEXTILE RESEARCH INSTITUTE (TW) 2011-04-28 US claimed
EP-1731580-B1 POLLUTION-FREE RUSTPROOF PIGMENT COMPOSITION DAINIPPON TORYO KK (JP) 2009-12-23 EP claimed
EP-4122972-B1 POLYETHER COMPOUND, IONIC COMPOSITION, AND MOLDED BODY ZEON CORP (JP) 2026-04-29 EP disclosed
US-12570798-B2 Polyether compound and gas separation membrane ZEON CORPORATION (JP) 2026-03-10 US disclosed
EP-4694606-A1 RADIO WAVE SHIELDING BODY AND ADHESIVE COMPOSITION Zeon Corporation (JP) 2026-02-11 EP disclosed
US-20250204567-A1 FUNCTIONAL WATER KUBOTA TORU (JP) 2025-06-26 US disclosed
EP-2254127-A1 Organogel for electrical cable insulating layer Nexans (FR) 2010-11-24 EP disclosed
EP-2254126-A1 Organogel for electrical cable insulating layer Nexans (FR) 2010-11-24 EP disclosed
WO-2010069854-A2 MODIFIED POLYOLEFIN WAXES BASF SE (DE) 2010-06-24 WO disclosed
CN-1329662-A Detergent composition PROCTER & GAMBLE (US) 2002-01-02 CN disclosed