SCHEMBL16618079

SCHEMBL16618079

C=CCCC(=C)C(=O)O.C=CCCC(=C)C(=O)O

nearest known ligand 0.59

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.44
ABCC4 O15439 1/20 0.44
ALOX15 P16050 1/20 0.44
HSD17B10 Q99714 1/20 0.44
TET2 Q6N021 5/20 0.36
TET3 O43151 1/20 0.36
TET1 Q8NFU7 1/20 0.36
GRIK1 P39086 1/20 0.34
GRIK2 Q13002 1/20 0.34
GRM1 Q13255 1/20 0.34
GRM2 Q14416 1/20 0.34
LMNA P02545 3/20 0.34
ALDH1A1 P00352 2/20 0.34
FAAH O00519 3/20 0.32
TBXAS1 P24557 1/20 0.31
USP2 O75604 1/20 0.31
CYP3A4 P08684 1/20 0.31
RECQL P46063 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18828 1.00
SCHEMBL4562517 0.97 MAPT (0.43) MAPTABCC4ALOX15HSD17B10TET2
Ammonia Solution, Strong SCHEMBL1076582 0.97 MAPT (0.43) MAPTABCC4ALOX15HSD17B10TET2
Fluoride SCHEMBL12006687 0.97 MAPT (0.43) MAPTABCC4ALOX15HSD17B10TET2
Butadiene SCHEMBL7115021 0.95 ABCC4 (0.41) MAPTABCC4ALOX15HSD17B10TET2
Hydrochloric Acid SCHEMBL2880740 0.95 ABCC4 (0.41) MAPTABCC4ALOX15HSD17B10TET2
SCHEMBL5140960 0.93 ABCC4 (0.40) MAPTABCC4ALOX15HSD17B10TET2
Acetic Acid SCHEMBL2160838 0.93 MAPT (0.40) MAPTABCC4ALOX15HSD17B10TET2
Carbamic Acid SCHEMBL4928399 0.93 ABCC4 (0.40) MAPTABCC4ALOX15HSD17B10TET2
SCHEMBL1955290 0.93 MAPT (0.40) MAPTABCC4ALOX15HSD17B10TET2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9464155-B2 Moisture-curable polyurethane hot-melt resin composition, adhesive, and article DIC CORPORATION (JP) 2016-10-11 US disclosed
US-20150099125-A1 MOISTURE-CURABLE POLYURETHANE HOT-MELT RESIN COMPOSITION, ADHESIVE, AND ARTICLE DIC CORPORATION (JP) 2015-04-09 US disclosed