Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALOX5 | P09917 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | TOP2A | P11388 | 1/20 | 0.32 |
| ▸ | TOP2B | Q02880 | 1/20 | 0.32 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28173246 | 0.81 | TOP2A (0.34) | ALOX5HSD17B10TOP2ATOP2BNPSR1 | |
| SCHEMBL992853 | 0.75 | — | — | |
| SCHEMBL16178016 | 0.72 | ADORA2A (0.33) | HSD17B10TOP2ATOP2BALDH1A1 | |
| SCHEMBL16061311 | 0.72 | ADORA2A (0.33) | HSD17B10TOP2ATOP2BALDH1A1 | |
| SCHEMBL16059003 | 0.72 | ADORA2A (0.33) | HSD17B10TOP2ATOP2BALDH1A1 | |
| SCHEMBL16915160 | 0.71 | RET (0.38) | ALOX5ALDH1A1KDM4EPOLB | |
| SCHEMBL367449 | 0.71 | — | — | |
| SCHEMBL7552234 | 0.71 | — | — | |
| SCHEMBL21217110 | 0.71 | — | — | |
| SCHEMBL29237864 | 0.71 | TOP2A (0.36) | TOP2ATOP2BNPSR1ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2228400-B1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHINETSU CHEMICAL CO (JP) | 2016-04-27 | — | — | EP | disclosed |
| US-8263308-B2 | Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2012-09-11 | — | — | US | disclosed |
| US-8048611-B2 | Polyorganosiloxane, resin composition, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2011-11-01 | — | — | US | disclosed |
| EP-2112188-B1 | Polyorganosiloxane, resin composition, and patterning process | SHINETSU CHEMICAL CO (JP) | 2011-04-27 | — | — | EP | disclosed |
| US-20100233619-A1 | NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-09-16 | — | — | US | disclosed |
| EP-2228400-A1 | Novel polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formation | Shin-Etsu Chemical Co., Ltd. (JP) | 2010-09-15 | — | — | EP | disclosed |
| US-20090269697-A1 | POLYORGANOSILOXANE, RESIN COMPOSITION, AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2009-10-29 | — | — | US | disclosed |
| EP-2112188-A1 | Polyorganosiloxane, resin composition, and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2009-10-28 | — | — | EP | disclosed |
| US-7030007-B2 | Via-filling material and process for fabricating semiconductor integrated circuit using the material | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2006-04-18 | — | — | US | disclosed |
| US-20050101123-A1 | Via-filling material and process for fabricating semiconductor integrated circuit using the material | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 2005-05-12 | — | — | US | disclosed |
| US-6287746-B1 | PHOTOACID GENERATOR | NEC CORPORATION (JP) | 2001-09-11 | — | — | US | disclosed |
| US-6030747-A | CHEMICALLY AMPLIFIED RESIST CONSISTS OF A PHOTOACID GENERATOR, A CROSSLINKING AGENT ACTIVATED IN PRESENCE OF ACID AND A COPOLYMER OF ACRYLIC OR METHACRYLIC ESTER CONTAINING AN ACID, HYDROXY OR ESTER POLAR GROUP AND A COMPOUND | NEC CORPORATION (JP) | 2000-02-29 | — | — | US | disclosed |
| US-4341650-A | Chemically stabilized azulmic acids, processes for their preparation and their use | BAYER AKTIENGESELLSCHAFT (DE) | 1982-07-27 | — | — | US | disclosed |
| US-4283219-A | PLANT GROWTH REGULATORS | BAYER AKTIENGESELLSCHAFT (DE) | 1981-08-11 | — | — | US | disclosed |
| US-4263181-A | Chemically stabilized azulmic acids, processes for their preparation and their use | BAYER AKTIENGESELLSCHAFT (DE) | 1981-04-21 | — | — | US | disclosed |
| US-4052158-A | CATALYTIC FREE RADICAL POLYMERIZATION, CURING | STAUFFER CHEMICAL COMPANY (US) | 1977-10-04 | — | — | US | disclosed |