SCHEMBL16969726

SCHEMBL16969726

CCCC/C=C(/O)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969731 1.00
SCHEMBL16969594 0.92
SCHEMBL16969598 0.92
SCHEMBL16970032 0.90 EP300 (0.56)
SCHEMBL16970028 0.90 EP300 (0.56)
SCHEMBL16969564 0.90 EP300 (0.56)
SCHEMBL16969559 0.90 EP300 (0.56)
SCHEMBL3760025 0.82
SCHEMBL3760035 0.82
SCHEMBL4135829 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200289525-A1 Methods of Increasing Microbial Diversity of a Skin Microbiota THE PROCTER & GAMBLE COMPANY 2020-09-17 US claimed
WO-2018050056-A1 METHODS OF INCREASING MICROBIAL DIVERSITY OF A SKIN MICROBIOTA THE PROCTER & GAMBLE COMPANY (US) 2018-03-22 WO claimed
CN-111936079-A Synthetic elastomer article and method of producing the same 皮肤防护有限公司 2020-11-13 CN disclosed
US-20200289525-A1 Methods of Increasing Microbial Diversity of a Skin Microbiota THE PROCTER & GAMBLE COMPANY 2020-09-17 US disclosed
WO-2018050056-A1 METHODS OF INCREASING MICROBIAL DIVERSITY OF A SKIN MICROBIOTA THE PROCTER & GAMBLE COMPANY (US) 2018-03-22 WO disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed