SCHEMBL16969741

SCHEMBL16969741

CCCCCCCCCCC(CO)C(=O)O

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GRIK1 P39086 2/20 0.61
GRIK2 Q13002 2/20 0.61
CA2 P00918 2/20 0.59
MAPK1 P28482 1/20 0.59
SLC1A2 P43004 2/20 0.58
SLC1A1 P43005 2/20 0.58
GPR84 Q9NQS5 6/20 0.57
FFAR1 O14842 1/20 0.57
MAPT P10636 1/20 0.55
LCK P06239 1/20 0.55
PPARD Q03181 1/20 0.55
ZDHHC20 Q5W0Z9 1/20 0.55
ZDHHC2 Q9UIJ5 1/20 0.55
LMNA P02545 1/20 0.52
ACE2 Q9BYF1 1/20 0.52
CHRM1 P11229 1/20 0.50
AKR1A1 P14550 1/20 0.50
CHRM3 P20309 1/20 0.50
HTR2A P28223 1/20 0.50
HTR2C P28335 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11158171 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL5173608 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL1231221 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL1857092 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16969979 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16892639 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16970260 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16970147 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16970151 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2
SCHEMBL16970152 1.00 GRIK1 (0.61) GRIK1GRIK2CA2MAPK1SLC1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3412796-B1 FILM MATERIAL AND COLD SPRAY METHOD TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP) 2021-09-15 EP disclosed
US-20180355487-A1 FILM MATERIAL AND COLD SPRAY METHOD TATSUTA ELECTRIC WIRE & CABLE CO., LTD. (JP) 2018-12-13 US disclosed
EP-3412796-A1 FILM MATERIAL AND COLD SPRAY METHOD Tatsuta Electric Wire & Cable Co., Ltd. (JP) 2018-12-12 EP disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed