SCHEMBL16969745

SCHEMBL16969745

CCCCCCCCCCCCCCCC(Br)(Br)Br

nearest known ligand 0.50

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.50
THRB P10828 1/20 0.50
GGPS1 O95749 6/20 0.42
FDPS P14324 9/20 0.41
SMPD1 P17405 2/20 0.39
CES2 O00748 1/20 0.39
LPAR1 Q92633 1/20 0.39
LPAR3 Q9UBY5 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16969544 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL997449 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL6667491 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969797 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970387 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969807 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL31482746 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL31482745 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16969774 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1
SCHEMBL16970377 1.00 TSHR (0.50) TSHRTHRBGGPS1FDPSSMPD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108699076-A Naphtho- indacene 1,4-Dithiapentalene and polymer 巴斯夫欧洲公司 2018-10-23 CN disclosed
EP-2905349-B1 Ag ball, solder joint, formed solder, solder paste and silver paste SENJU METAL INDUSTRY CO (JP) 2017-05-17 EP disclosed
US-9266196-B2 Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2016-02-23 US disclosed
EP-2905349-A2 Ag ball, Ag core ball, flux-coated Ag ball, flux-coated Ag core ball, solder joint, formed solder, solder paste and Ag paste SENJU METAL INDUSTRY CO., LTD. (JP) 2015-08-12 EP disclosed
US-20150217409-A1 Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE Senju Metal lndustry Co., Ltd. (JP) 2015-08-06 US disclosed