⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1797068 | 0.57 | — | — | |
| SCHEMBL546592 | 0.50 | — | — | |
| SCHEMBL20265959 | 0.50 | — | — | |
| SCHEMBL2138817 | 0.50 | — | — | |
| SCHEMBL2574671 | 0.50 | — | — | |
| SCHEMBL28523616 | 0.50 | — | — | |
| SCHEMBL4575179 | 0.50 | — | — | |
| SCHEMBL126179 | 0.50 | — | — | |
| SCHEMBL905796 | 0.50 | — | — | |
| SCHEMBL5369357 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115976570-A | Catalyst for preparing ammonia by reduction of nitrate and preparation method and application thereof | 北京石油化工学院 | 2023-04-18 | — | — | CN | disclosed |
| US-9622346-B2 | Adhesive body comprising conductive polymer-metal complex and substrate and method for forming the same, conductive polymer-metal complex dispersion liquid, method for manufacturing the same and method for applying the same, and method for filling hole using conductive material | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2017-04-11 | — | — | US | disclosed |
| US-20150282310-A1 | ADHESIVE BODY BETWEEN CONDUCTIVE POLYMER-METAL COMPLEX AND SUBSTRATE AND METHOD FOR FORMING THE SAME, CONDUCTIVE POLYMER-METAL COMPLEX DISPERSION LIQUID, METHOD FOR MANUFACTURING THE SAME AND METHOD FOR APPLYING THE SAME, AND METHOD FOR FILLING HOLE USING CONDUCTIVE MATERIAL | NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) | 2015-10-01 | — | — | US | disclosed |
| EP-2911159-A1 | ADHESIVE BODY BETWEEN CONDUCTIVE POLYMER-METAL COMPLEX AND SUBSTRATE AND METHOD FOR FORMING ADHESIVE BODY, CONDUCTIVE POLYMER-METAL COMPLEX DISPERSION LIQUID, METHOD FOR MANUFACTURING AND APPLYING SAME, AND METHOD FOR FILLING HOLE USING CONDUCTIVE MATERIAL | National Institute for Materials Science (JP) | 2015-08-26 | — | — | EP | disclosed |