SCHEMBL170596

SCHEMBL170596

C=CCS(=O)(=O)C(S(=O)(=O)CC=C)S(=O)(=O)CC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14955465 0.77
SCHEMBL12274522 0.77
SCHEMBL303281 0.75
SCHEMBL982269 0.73
SCHEMBL11499750 0.73
SCHEMBL5250874 0.73
SCHEMBL3345520 0.73
SCHEMBL7131928 0.71
SCHEMBL27739048 0.71
SCHEMBL1425619 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 609 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1353225-B1 Radiation sensitive composition and compound FUJIFILM CORP (JP) 2014-06-04 EP claimed
US-8426101-B2 Photosensitive composition, pattern-forming method using the photosensitve composition and compound in the photosensitive composition FUJIFILM CORPORATION (JP) 2013-04-23 US claimed
EP-1406122-B1 PHOTOSENSITIVE COMPOSITION AND ACID GENERATOR FUJIFILM CORP (JP) 2013-01-09 EP claimed
US-8252508-B2 Positive photosensitive composition and method of forming resist pattern FUJIFILM CORPORATION (JP) 2012-08-28 US claimed
US-8241830-B2 Positive resist composition and a pattern forming method using the same FUJIFILM CORPORATION (JP) 2012-08-14 US claimed
US-7867697-B2 Positive photosensitive composition and method of forming resist pattern FUJIFILM CORPORATION (JP) 2011-01-11 US claimed
US-20100261117-A1 POSITIVE PHOTOSENSITIVE COMPOSITION AND METHOD OF FORMING RESIST PATTERN FUJIFILM CORPORATION (JP) 2010-10-14 US claimed
US-7510822-B2 Stimulation sensitive composition and compound FUJIFILM CORPORATION (JP) 2009-03-31 US claimed
US-7192685-B2 Positive resist composition and method of forming resist pattern using the same. FUJI PHOTO FILM CO., LTD. (JP) 2007-03-20 US claimed
US-20070042291-A1 Positive resist composition and a pattern forming method using the same FUJI PHOTO FILM CO., LTD. 2007-02-22 US claimed
EP-1755000-A2 Positive resist composition and a pattern forming method using the same Fuji Photo Film Co., Ltd. (JP) 2007-02-21 EP claimed
US-7090960-B2 Negative resist composition FUJI PHOTO FILM CO., LTD. (JP) 2006-08-15 US claimed
US-7074544-B2 Image recording material FUJI PHOTO FILM CO., LTD. (JP) 2006-07-11 US claimed
US-20050142484-A1 Image recording material FUJI PHOTO FILM CO., LTD. 2005-06-30 US claimed
US-6830867-B2 Acid generator capable of generating an acid by irradiation with actinic ray or radiation and having a structure represented by formula (I) defined in the specification and (B) a resin having a monocyclic or polycyclic alicyclic FUJI PHOTO FILM CO., LTD. (JP) 2004-12-14 US claimed
US-20030165776-A1 Negative resist composition FUJI PHOTO FILM CO., LTD. 2003-09-04 US claimed
US-11579528-B2 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2023-02-14 US disclosed
US-11181820-B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2021-11-23 US disclosed
EP-1300727-A2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-04-09 EP disclosed
US-6008267-A CATIONIC POLYMERS HAVING ONIUM GROUPS AND A SULFONIMIDE ANION AS PHOTOINITIATORS FOR PHOTOPOLYMERIZATION; ADHESIVES; COATINGS; PHOTORESISTS HYDRO-QUEBEC (CA) 1999-12-28 US disclosed