Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9421258 | 0.83 | CYP3A4 (0.30) | — | |
| SCHEMBL272921 | 0.82 | — | — | |
| SCHEMBL28867282 | 0.81 | — | — | |
| SCHEMBL28524403 | 0.79 | TP53 (0.31) | — | |
| SCHEMBL443543 | 0.78 | — | — | |
| SCHEMBL6826929 | 0.75 | — | — | |
| SCHEMBL28545090 | 0.75 | — | — | |
| SCHEMBL29570362 | 0.75 | TSHR (0.47) | — | |
| SCHEMBL6826959 | 0.75 | SMPD1 (0.33) | — | |
| SCHEMBL27164728 | 0.75 | TP53 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112180680-A | Radical-cation hybrid photocurable composition and photosensitive dry film resist | 四川乐凯新材料有限公司 | 2021-01-05 | — | — | CN | claimed |
| CN-112147843-A | Cationic photocurable composition and photosensitive dry film resist | 四川乐凯新材料有限公司 | 2020-12-29 | — | — | CN | claimed |
| WO-2023182281-A1 | ENCAPSULANT FOR ORGANIC ELECTROLUMINESCENT ELEMENT, ENCAPSULATION MATERIAL, AND ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE | デンカ株式会社 | 2023-09-28 | — | — | WO | disclosed |
| WO-2023074630-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND LAMINATE PRODUCTION METHOD | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| CN-115469510-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 昭和电工材料株式会社 | 2022-12-13 | — | — | CN | disclosed |
| CN-115167077-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2022-10-11 | — | — | CN | disclosed |
| WO-2022174211-A1 | PHOTOSENSITIVE COMPOSITION AND PHOTORESIST DRY FILM MADE | DUPONT ELECTRONICS, INC. (US) | 2022-08-18 | — | — | WO | disclosed |
| CN-114902137-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-108027556-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel | 昭和电工材料株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-112180680-A | Radical-cation hybrid photocurable composition and photosensitive dry film resist | 四川乐凯新材料有限公司 | 2021-01-05 | — | — | CN | disclosed |
| CN-112147843-A | Cationic photocurable composition and photosensitive dry film resist | 四川乐凯新材料有限公司 | 2020-12-29 | — | — | CN | disclosed |
| US-10717893-B2 | Photosensitive film, photosensitive element, cured product and touch panel | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-07-21 | — | — | US | disclosed |
| US-10564543-B2 | Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-02-18 | — | — | US | disclosed |
| US-10104781-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-10-16 | — | — | US | disclosed |
| US-20180265732-A1 | PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, CURED PRODUCT AND TOUCH PANEL | RESONAC CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| US-10040967-B2 | Photosensitive film, photosensitive element, cured product and touch panel | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-08-07 | — | — | US | disclosed |
| US-20170261851-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2017-09-14 | — | — | US | disclosed |
| US-20170130088-A1 | PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, CURED PRODUCT AND TOUCH PANEL | RESONAC CORPORATION (JP) | 2017-05-11 | — | — | US | disclosed |
| US-20160330845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| US-20150293443-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-10-15 | — | — | US | disclosed |