SCHEMBL1717567

SCHEMBL1717567

C=CC(=O)OC(CC)C1(C)CC[Si](C)(C)[Si](C)(C)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10890680 0.89
SCHEMBL27927758 0.85
SCHEMBL10660058 0.82
SCHEMBL464816 0.82
SCHEMBL28859871 0.74
SCHEMBL10885524 0.74
SCHEMBL10883859 0.72
SCHEMBL23070781 0.72
SCHEMBL3113887 0.71 TSHR (0.33)
SCHEMBL10885939 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119630371-A Article fixing device, method for removing article, and adhesive sheet unit 舒万诺知识产权公司 2025-03-14 CN disclosed
EP-3650514-B1 ULTRAVIOLET CURABLE SILICONE ADHESIVE COMPOSITION AND SILICONE ADHESIVE FILM SHINETSU CHEMICAL CO (JP) 2024-09-18 EP disclosed
US-11306230-B2 Ultraviolet curable silicone adhesive composition and silicone adhesive film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-04-19 US disclosed
CN-108027525-B Contact lens package and method of making same 株式会社目立康 2021-08-10 CN disclosed
US-20200172778-A1 ULTRAVIOLET CURABLE SILICONE ADHESIVE COMPOSITION AND SILICONE ADHESIVE FILM SHIN-ETSU CHEMICAL CO, LTD. (JP) 2020-06-04 US disclosed
EP-3650514-A1 ULTRAVIOLET CURABLE SILICONE ADHESIVE COMPOSITION AND SILICONE ADHESIVE FILM Shin-Etsu Chemical Co., Ltd. (JP) 2020-05-13 EP disclosed
US-8168371-B2 Positive photosensitive resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2012-05-01 US disclosed
EP-2109001-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION NISSAN CHEMICAL IND LTD (JP) 2012-01-11 EP disclosed
US-20100028805-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-04 US disclosed
EP-2109001-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2009-10-14 EP disclosed
US-7335784-B2 Method for distillation of organosilicon compounds that contain acryloxy or methacryloxy groups DOW CORNING TORAY COMPANY, LTD. (JP) 2008-02-26 US disclosed
EP-1608666-B1 METHOD FOR DISTILLATION OF ORGANOSILICON COMPOUNDS THAT CONTAIN ACRYLOXY OR METHACRYLOXY GROUPS DOW CORNING TORAY CO LTD (JP) 2008-01-09 EP disclosed
US-20070004930-A1 Method for distillation of organosilicon compounds that contain acryloxy or methacryloxy groups DOW TORAY CO., LTD. (JP) 2007-01-04 US disclosed
EP-1608666-A1 METHOD FOR DISTILLATION OF ORGANOSILICON COMPOUNDS THAT CONTAIN ACRYLOXY OR METHACRYLOXY GROUPS Dow Corning Toray Co., Ltd. (JP) 2005-12-28 EP disclosed
WO-2004085446-A1 METHOD FOR DISTILLATION OF ORGANOSILICON COMPOUNDS THAT CONTAIN ACRYLOXY OR METHACRYLOXY GROUPS DOW CORNING TORAY CO., LTD. (JP) 2004-10-07 WO disclosed
US-4743667-A ACRYLATED SILOXXANES, OXYGEN PERMEABLE NIPPON CONTACT LENS, INC. (JP) 1988-05-10 US disclosed
US-4718748-A CURABLE POLYSILOXANE U.S. PHILIPS CORPORATION (US) 1988-01-12 US disclosed