⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17605 | 0.85 | — | — | |
| Dimethylamine SCHEMBL3990355 | 0.83 | MAPT (0.50) | — | |
| SCHEMBL3194340 | 0.81 | MAPT (0.56) | — | |
| SCHEMBL7850457 | 0.81 | MAPT (0.56) | — | |
| Bromide SCHEMBL8460963 | 0.81 | — | — | |
| Fluoride SCHEMBL1811139 | 0.81 | — | — | |
| SCHEMBL7847303 | 0.81 | MAPT (0.56) | — | |
| Ammonia Solution, Strong SCHEMBL3796062 | 0.81 | — | — | |
| Water SCHEMBL1283690 | 0.81 | — | — | |
| Ethylene Glycol SCHEMBL28558185 | 0.81 | MAPT (0.56) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108693718-B | Resist stripping liquid composition | 东友精细化工有限公司 | 2022-07-29 | — | — | CN | claimed |
| CN-108693718-A | Anticorrosive additive stripping liquid controlling composition | 东友精细化工有限公司 | 2018-10-23 | — | — | CN | claimed |
| CN-104629700-B | A kind of sulfur elimination for being used to produce water oil well and water-producing gas well | 成都理工大学 | 2018-05-01 | — | — | CN | claimed |
| EP-1031884-B1 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL CO (JP) | 2012-01-11 | — | — | EP | claimed |
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | claimed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | claimed |
| CN-101398639-A | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO LTD (KR) | 2009-04-01 | — | — | CN | claimed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | claimed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | claimed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | claimed |
| US-20240034930-A1 | PATTERNING MATERIAL, PATTERNING COMPOSITION, AND PATTERN FORMING METHOD | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2024-02-01 | — | — | US | disclosed |
| CN-108693718-B | Resist stripping liquid composition | 东友精细化工有限公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-108693718-A | Anticorrosive additive stripping liquid controlling composition | 东友精细化工有限公司 | 2018-10-23 | — | — | CN | disclosed |
| CN-104629700-B | A kind of sulfur elimination for being used to produce water oil well and water-producing gas well | 成都理工大学 | 2018-05-01 | — | — | CN | disclosed |
| WO-2017081003-A1 | SUBSTITUTED PYRAZOLOPYRIDINAMINES | BAYER PHARMA AKTIENGESELLSCHAFT (DE) | 2017-05-18 | — | — | WO | disclosed |
| US-20040048761-A1 | Cleaning composition | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6638694-B2 | Mixtures of amines, water soluble solvents and corrosion resistance agents, used for removing photoresist films and residues after etching semiconductor integrated circuits or liquid crystal displays | MITSUBISHI GAS CHEMICAL COMPANY, INC (JP) | 2003-10-28 | — | — | US | disclosed |
| US-20030186175-A1 | RESIST STRIPPING AGENT AND PROCESS OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME | IKEMOTO KAZUTO (JP) | 2003-10-02 | — | — | US | disclosed |
| US-20030152874-A1 | Photoresist stripping composition and process for stripping resist | MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) | 2003-08-14 | — | — | US | disclosed |
| EP-1031884-A2 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2000-08-30 | — | — | EP | disclosed |