⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL11305307 | 0.95 | — | — | |
| SCHEMBL16579714 | 0.74 | AKR1B1 (0.33) | — | |
| SCHEMBL22988689 | 0.74 | — | — | |
| SCHEMBL1013973 | 0.67 | — | — | |
| SCHEMBL7107893 | 0.67 | — | — | |
| SCHEMBL7257331 | 0.67 | — | — | |
| SCHEMBL3844855 | 0.67 | — | — | |
| SCHEMBL6300349 | 0.67 | — | — | |
| SCHEMBL12161098 | 0.67 | — | — | |
| SCHEMBL2151156 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 139 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2758507-B1 | COMPOSITION FOR REMOVING SUBSTANCES FROM SUBSTRATES | VERSUM MAT US LLC (US) | 2020-06-03 | — | — | EP | claimed |
| US-9158202-B2 | Process and composition for removing substances from substrates | DYNALOY, LLC (US) | 2015-10-13 | — | — | US | claimed |
| US-20150219996-A1 | COMPOSITION FOR REMOVING SUBSTANCES FROM SUBSTRATES | DYNALOY, LLC (US) | 2015-08-06 | — | — | US | claimed |
| EP-2758507-A1 | PROCESS AND COMPOSITION FOR REMOVING SUBSTANCES FROM SUBSTRATES | Dynaloy, LLC (US) | 2014-07-30 | — | — | EP | claimed |
| WO-2014081465-A1 | PROCESS AND COMPOSITION FOR REMOVING SUBSTANCES FROM SUBSTRATES | DYNALOY, LLC (US) | 2014-05-30 | — | — | WO | claimed |
| US-20140142017-A1 | Process And Composition For Removing Substances From Substrates | DYNALOY, LLC (US) | 2014-05-22 | — | — | US | claimed |
| US-20130116159-A1 | PHOTORESIST AND POST ETCH RESIDUE CLEANING SOLUTION | DYNALOY, LLC (US) | 2013-05-09 | — | — | US | claimed |
| EP-1031884-B1 | Resist stripping agent and process of producing semiconductor devices using the same | MITSUBISHI GAS CHEMICAL CO (JP) | 2012-01-11 | — | — | EP | claimed |
| US-7968507-B2 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | claimed |
| US-20090084406-A1 | Composition for stripping and stripping method | SAMSUNG ELECTRONICS CO., LTD. | 2009-04-02 | — | — | US | claimed |
| US-5112983-A | Process for producing 1,2,4-triazol-5-one using organic sulfonic acids and polymers thereof as a catalyst | OLIN CORPORATION (US) | 1992-05-12 | — | — | US | claimed |
| EP-0399842-A2 | Emulsified preparations containing perfluorocarbon compound | THE GREEN CROSS CORPORATION (JP) | 1990-11-28 | — | — | EP | claimed |
| US-3983564-A | Image recording member | CANON KABUSHIKI KAISHA (JA) | 1976-09-28 | — | — | US | claimed |
| WO-2024128210-A1 | COMPOSITION FOR PHOTORESIST REMOVAL AND METHOD FOR REMOVING PHOTORESIST | 三菱瓦斯化学株式会社 | 2024-06-20 | — | — | WO | disclosed |
| WO-2024128209-A1 | COMPOSITION FOR PHOTORESIST REMOVAL AND METHOD FOR REMOVING PHOTORESIST | 三菱瓦斯化学株式会社 | 2024-06-20 | — | — | WO | disclosed |
| WO-2024128211-A1 | COMPOSITION FOR PHOTORESIST REMOVAL AND METHOD FOR REMOVING PHOTORESIST | 三菱瓦斯化学株式会社 | 2024-06-20 | — | — | WO | disclosed |
| US-4191533-A | Pregnancy-specific β1 -glycoprotein and process for isolating it | BEHRINGWERKE AKTIENGESELLSCHAFT (DE) | 1980-03-04 | — | — | US | disclosed |
| US-4065445-A | Pregnancy-specific β1 -glycoprotein and process for isolating it | BEHRINGWERKE AKTIENGESELLSCHAFT (DT) | 1977-12-27 | — | — | US | disclosed |
| US-3983564-A | Image recording member | CANON KABUSHIKI KAISHA (JA) | 1976-09-28 | — | — | US | disclosed |
| US-3966818-A | FROM 2,4,6-TRIMETHYLPHENOL AND OXYGEN | TEIJIN LIMITED (JA) | 1976-06-29 | — | — | US | disclosed |