SCHEMBL17308702

SCHEMBL17308702

C/C=C/CP(C(C)(C)C)C(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17287590 0.81 CNR1 (0.30)
SCHEMBL17287477 0.79
SCHEMBL17287534 0.74
SCHEMBL17287641 0.74
SCHEMBL17287737 0.74
SCHEMBL17287837 0.72
SCHEMBL17287540 0.70
SCHEMBL17287473 0.69
SCHEMBL17287799 0.67
SCHEMBL7036699 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200385361-A1 METHOD FOR PRODUCING 2-SUBSTITUTED-3-ETHYLSULFONYLPYRIDINE COMPOUND AND LIKE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2020-12-10 US claimed
EP-3722289-A1 METHOD FOR PRODUCING 2-SUBSTITUTED-3-ETHYLSULFONYL PYRIDINE COMPOUND AND LIKE Sumitomo Chemical Company Limited (JP) 2020-10-14 EP claimed
EP-3892611-B1 METHOD FOR PRODUCING FLUOROVINYL AMIDE COMPOUND DAIKIN IND LTD (JP) 2026-01-28 EP disclosed
EP-4586285-A1 RESIN COMPOSITION AJINOMOTO CO., INC. (JP) 2025-07-16 EP disclosed
US-20250214936-A1 METHOD FOR PRODUCING FLUOROVINYL AMIDE COMPOUND DAIKIN INDUSTRIES, LTD. (JP) 2025-07-03 US disclosed
EP-4567840-A1 RESIN COMPOSITION Ajinomoto Co., Inc. (JP) 2025-06-11 EP disclosed
US-12297301-B2 High-molecular-weight compound and method for producing same, composition and method for producing same, resin composition, additive for lubricating oil, and lubricating oil MITSUBISHI CHEMICAL CORPORATION (JP) 2025-05-13 US disclosed
US-12195636-B2 Resin composition, cured product, sheet lamination material, resin sheet, printed wiring board, and semiconductor device, and method for producing printed wiring board AJINOMOTO CO., INC. (JP) 2025-01-14 US disclosed
EP-4484499-A1 RESIN COMPOSITION AJINOMOTO CO., INC. (JP) 2025-01-01 EP disclosed
WO-2024157820-A1 RESIN SHEET 味の素株式会社 2024-08-02 WO disclosed
US-20240254328-A1 RESIN COMPOSITION AJINOMOTO CO., INC. (JP) 2024-08-01 US disclosed
US-20180237629-A1 CURABLE COMPOSITION TOAGOSEI CO., LTD. (JP) 2018-08-23 US disclosed
US-20180237576-A1 CURABLE COMPOSITION, ADHESIVE, ARTICLE HAVING COATING LAYER, FIBER-REINFORCED COMPOSITE MATERIAL AND CURABLE COMPOSITION KIT MITSUBISHI CHEMICAL CORPORATION (JP) 2018-08-23 US disclosed
US-20180118658-A1 (METH)ACRYLATE MANUFACTURING METHOD TOAGOSEI CO., LTD. (JP) 2018-05-03 US disclosed
EP-3281933-A1 (METH)ACRYLATE MANUFACTURING METHOD Toagosei Co., Ltd. (JP) 2018-02-14 EP disclosed
US-9707551-B2 Reaction catalyst for cross-coupling and method for manufacturing aromatic compound HOKKO CHEMICAL INDUSTRY CO., LTD. (JP) 2017-07-18 US disclosed
US-9707551-B2 Reaction catalyst for cross-coupling and method for manufacturing aromatic compound HOKKO CHEMICAL INDUSTRY CO., LTD. (JP) 2017-07-18 US disclosed
US-20150360214-A1 REACTION CATALYST FOR CROSS-COUPLING AND METHOD FOR MANUFACTURING AROMATIC COMPOUND HOKKO CHEMICAL INDUSTRY CO., LTD. (JP) 2015-12-17 US disclosed
US-20150360214-A1 REACTION CATALYST FOR CROSS-COUPLING AND METHOD FOR MANUFACTURING AROMATIC COMPOUND HOKKO CHEMICAL INDUSTRY CO., LTD. (JP) 2015-12-17 US disclosed
EP-2949655-A1 REACTION CATALYST FOR CROSS COUPLING AND METHOD FOR MANUFACTURING AROMATIC COMPOUND Hokko Chemical Industry Co., Ltd. (JP) 2015-12-02 EP disclosed