⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28442395 | 0.97 | — | — | |
| Nitrous Acid SCHEMBL28464261 | 0.84 | TSHR (0.42) | — | |
| Nitrous Acid SCHEMBL28464259 | 0.84 | TSHR (0.42) | — | |
| SCHEMBL30806211 | 0.73 | — | — | |
| SCHEMBL19298582 | 0.71 | TSHR (1.00) | — | |
| Benzene SCHEMBL17977991 | 0.71 | TSHR (1.00) | — | |
| SCHEMBL385175 | 0.71 | — | — | |
| SCHEMBL4454 | 0.71 | — | — | |
| SCHEMBL3008675 | 0.71 | — | — | |
| SCHEMBL10653964 | 0.71 | TDP1 (0.55) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 944 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4683434-A1 | INSULATION FILM AND PRINTED CIRCUIT BOARD COMPRISING SAME | LG Chem, Ltd. (KR) | 2026-01-21 | — | — | EP | claimed |
| WO-2025121410-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | パナソニックＩＰマネジメント株式会社 | 2025-06-12 | — | — | WO | claimed |
| WO-2025110104-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | パナソニックＩＰマネジメント株式会社 | 2025-05-30 | — | — | WO | claimed |
| WO-2025110106-A1 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE | パナソニックＩＰマネジメント株式会社 | 2025-05-30 | — | — | WO | claimed |
| CN-116875053-B | Resin composition and application thereof | 常熟生益科技有限公司 | 2025-05-16 | — | — | CN | claimed |
| US-20250108582-A1 | RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) | 2025-04-03 | — | — | US | claimed |
| CN-119570475-A | Silane modified composite electrochromic material and preparation method thereof | 安徽科技学院 | 2025-03-07 | — | — | CN | claimed |
| CN-119490642-A | Phase-change temperature-control polyurethane material and preparation method thereof | 南通通易航天科技股份有限公司 | 2025-02-21 | — | — | CN | claimed |
| CN-118841556-B | Silicon-based composite material containing organic flexible coating layer and preparation method thereof | 北京壹金新能源科技有限公司 | 2024-11-26 | — | — | CN | claimed |
| CN-118931420-A | Silicon dioxide composite slurry and preparation method and application thereof | 联瑞新材(连云港)有限公司 | 2024-11-12 | — | — | CN | claimed |
| WO-2001049628-A1 | CATALYTICALLY POLYMERIZED FIBER-REINFORCED COMPOSITES | OWENS CORNING (US) | 2001-07-12 | — | — | WO | claimed |
| CN-1064062-C | Epoxy resin composition used for formation and press molt articles of high voltage apparatus using same and preparation of same | MITSUBISHI ELECTRIC CORP (JP) | 2001-04-04 | — | — | CN | claimed |
| US-5939472-A | COMPRISING EPOXY RESIN, ACID ANHYDRIDE, CURING ACCELERATOR,COUPLING AGENT AND FILLER; USED FOR APPARATUS FOR HIGH VOLTAGE SUCH AS TRANSFORMER, MOTOR, GAS INSULATED APPARATUS | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1999-08-17 | — | — | US | claimed |
| US-5919567-A | Magnetic head | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1999-07-06 | — | — | US | claimed |
| US-5880179-A | MOLDINGS OF EPOXY RESINS WITH HEAT RESISTANCE | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1999-03-09 | — | — | US | claimed |
| US-5874617-A | REACTING AN ACID FLUORIDE WITH AN N-SILYANILINE IN THE PRESENCE OF A BASIC COMPOUND; EFFICIENCY; VOLATILE BY-PRODUCT REMOVED BY VACUUM DISTILLATION; NO FILTERING STEP REQUIRED | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1999-02-23 | — | — | US | claimed |
| US-5662776-A | EPOXY BINDERS WITH PHENYLAMINOSILANE COUPLERS FOR NONWOVEN FABRICS | SHIN-KOBE ELECTRIC MACHINERY CO. (JP) | 1997-09-02 | — | — | US | claimed |
| CN-1110977-A | Epoxy resin composition used for formation and press molt articles of high voltage apparatus using same and preparation of same | MITSUBISHI ELECTRIC CORP (JP) | 1995-11-01 | — | — | CN | claimed |
| EP-0673957-A2 | Epoxy resin moulding composition | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1995-09-27 | — | — | EP | claimed |
| US-4786558-A | Composite film and antistatic composite film comprising a swellable inorganic silicate | TORAY INDUSTRIES, LTD. (JP) | 1988-11-22 | — | — | US | claimed |