⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21571776 | 0.67 | — | — | |
| SCHEMBL513691 | 0.64 | — | — | |
| SCHEMBL10864849 | 0.64 | — | — | |
| SCHEMBL4898562 | 0.64 | — | — | |
| SCHEMBL144415 | 0.62 | — | — | |
| SCHEMBL24813601 | 0.62 | — | — | |
| SCHEMBL14164397 | 0.62 | — | — | |
| SCHEMBL6408171 | 0.62 | — | — | |
| SCHEMBL9159963 | 0.60 | — | — | |
| SCHEMBL20638603 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2705037-B1 | SUBSTITUTED IMIDAZOPYRIDINES AND IMIDAZOPYRIDAZINES AND USE THEREOF | BAYER IP GMBH (DE) | 2016-06-22 | — | — | EP | claimed |
| EP-2699578-B1 | FLUOROALKYL-SUBSTITUTED PYRAZOLOPYRIDINES AND USE THEREOF | BAYER IP GMBH (DE) | 2016-04-20 | — | — | EP | claimed |
| US-20180211845-A1 | METHODS OF MINIMIZING PLASMA-INDUCED SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2018-07-26 | — | — | US | disclosed |
| US-20170229316-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AIR LIQUIDE AMERICAN (US) | 2017-08-10 | — | — | US | disclosed |
| US-9659788-B2 | Nitrogen-containing compounds for etching semiconductor structures | AMERICAN AIR LIQUIDE, INC. (US) | 2017-05-23 | — | — | US | disclosed |
| US-20170110336-A1 | METHODS FOR MINIMIZING SIDEWALL DAMAGE DURING LOW K ETCH PROCESSES | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude (FR) | 2017-04-20 | — | — | US | disclosed |
| US-20150371869-A1 | NITROGEN-CONTAINING COMPOUNDS FOR ETCHING SEMICONDUCTOR STRUCTURES | AMERICAN AIR LIQUIDE, INC. | 2015-12-24 | — | — | US | disclosed |