SCHEMBL17445972

SCHEMBL17445972

CNCC(O)COc1ccc(C(C)(C)c2ccc(OCC(O)CN(C)CC(O)COc3ccc(C)cc3)cc2)cc1

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HTT P42858 1/20 0.62
▸ HIF1A Q16665 1/20 0.62
▸ CA12 O43570 4/20 0.48
▸ CA1 P00915 4/20 0.48
▸ CA2 P00918 4/20 0.48
▸ CA9 Q16790 4/20 0.48
▸ ADRB2 P07550 2/20 0.48
▸ ADRB1 P08588 2/20 0.48
▸ AR P10275 1/20 0.48
▸ KDM4E B2RXH2 2/20 0.47
▸ ALDH1A1 P00352 2/20 0.47
▸ CDK4 P11802 2/20 0.46
▸ GAA P10253 1/20 0.44
▸ MAPT P10636 1/20 0.44
▸ NPC1 O15118 1/20 0.44
▸ KMT2A Q03164 3/20 0.44
▸ MEN1 O00255 2/20 0.44
▸ CDK2 P24941 1/20 0.43
▸ CYP1A2 P05177 1/20 0.42
▸ CYP3A4 P08684 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14978759 0.87 HTT (0.61) HTTHIF1ACA12CA1CA2
SCHEMBL6259021 0.83 CA12 (0.61) HTTCA12CA1CA2CA9
SCHEMBL10313438 0.81 HTT (0.65) HTTHIF1AARKDM4EALDH1A1
SCHEMBL22745399 0.81 HTT (0.65) HTTHIF1AARKDM4EALDH1A1
SCHEMBL14085644 0.79 HIF1A (0.97) HTTHIF1AARKDM4EALDH1A1
SCHEMBL24046837 0.77 HTT (0.60) HTTHIF1AARKDM4EALDH1A1
SCHEMBL17828237 0.77 HIF1A (0.72) HTTHIF1AARKDM4EALDH1A1
SCHEMBL11316310 0.77 HIF1A (0.82) HTTHIF1AARKDM4EALDH1A1
SCHEMBL13963728 0.76 HTT (0.58) HTTHIF1AARKDM4EALDH1A1
SCHEMBL12135524 0.76 HTT (0.58) HTTHIF1AARKDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9496170-B2 Interconnect having air gaps and polymer wrapped conductive lines TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-11-15 — — US disclosed
US-20160172232-A1 Interconnect Having Air Gaps and Polymer Wrapped Conductive Lines TAIWAN SEMICONDUCTOR MFG (TW) 2016-06-16 — — US disclosed
US-9269668-B2 Interconnect having air gaps and polymer wrapped conductive lines TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-02-23 — — US disclosed
US-20160020176-A1 INTERCONNECT HAVING AIR GAPS AND POLYMER WRAPPED CONDUCTIVE LINES TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2016-01-21 — — US disclosed
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