SCHEMBL17467602

SCHEMBL17467602

CC(c1ccccc1)(c1ccc(OCC(O)COc2ccc(C(C)(c3ccccc3)c3ccc(OCC4CO4)cc3)cc2)cc1)c1ccc(OCC2CO2)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 6/20 0.67
MEN1 O00255 5/20 0.67
ALDH1A1 P00352 6/20 0.58
TP53 P04637 3/20 0.58
TSHR P16473 3/20 0.58
MAPT P10636 3/20 0.58
HIF1A Q16665 3/20 0.58
HPGD P15428 2/20 0.58
CYP1A2 P05177 1/20 0.58
PPARG P37231 1/20 0.58
TDP1 Q9NUW8 1/20 0.54
PKM P14618 2/20 0.45
LMNA P02545 1/20 0.45
GAA P10253 1/20 0.45
CYP2D6 P10635 1/20 0.43
CYP3A4 P08684 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
GRM2 Q14416 1/20 0.41
HTT P42858 2/20 0.41
GLA P06280 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12927404 0.96 KMT2A (0.74) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL14616787 0.96 KMT2A (0.74) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL12927406 0.94 KMT2A (0.60) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL18230812 0.94 KMT2A (0.63) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL21514938 0.93 KMT2A (0.62) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL13514855 0.92 KMT2A (0.60) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL16406951 0.91 KMT2A (0.72) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL3544569 0.91 KMT2A (0.72) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL16406955 0.91 KMT2A (0.72) KMT2AMEN1ALDH1A1TP53TSHR
SCHEMBL17464405 0.90 KMT2A (0.76) KMT2AMEN1ALDH1A1TP53TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9493651-B2 Halogen-free resin composition, and prepreg and laminate for printed circuits using the same SHENGYI TECHNOLOGY CO., LTD. (CN) 2016-11-15 US disclosed
US-20160024304-A1 HALOGEN-FREE RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED CIRCUITS USING THE SAME SHENGYI TECHNOLOGY CO., LTD. (CN) 2016-01-28 US disclosed