⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6284383 | 0.67 | — | — | |
| SCHEMBL11470556 | 0.64 | — | — | |
| SCHEMBL28175440 | 0.61 | — | — | |
| SCHEMBL11819518 | 0.59 | — | — | |
| SCHEMBL9127568 | 0.57 | — | — | |
| SCHEMBL11199390 | 0.56 | — | — | |
| SCHEMBL30132209 | 0.54 | — | — | |
| SCHEMBL27529973 | 0.54 | — | — | |
| SCHEMBL22265037 | 0.54 | — | — | |
| SCHEMBL15058852 | 0.53 | MAPT (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114127181-B | Thermoplastic resin composition and molded article thereof | 大科能宇菱通株式会社 | 2024-05-28 | — | — | CN | disclosed |
| CN-116685640-A | Thermoplastic composition and molded article thereof | 大科能宇菱通株式会社 | 2023-09-01 | — | — | CN | disclosed |
| CN-111032715-B | Thermoplastic resin composition and molded article with reduced impact noise | 大科能宇菱通株式会社 | 2022-10-04 | — | — | CN | disclosed |
| EP-2985314-B1 | CONTACTING COMPONENT AND STRUCTURE CONTAINING SAID CONTACTING COMPONENT | TECHNO UMG CO LTD (JP) | 2021-06-02 | — | — | EP | disclosed |
| WO-2020175612-A9 | THERMOPLASTIC RESIN COMPOSITION REDUCED IN RATTLING SOUND, AND MOLDED ARTICLE | テクノＵＭＧ株式会社 | 2021-04-15 | — | — | WO | disclosed |
| WO-2021070633-A1 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | テクノＵＭＧ株式会社 | 2021-04-15 | — | — | WO | disclosed |
| WO-2021049447-A1 | RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | テクノＵＭＧ株式会社 | 2021-03-18 | — | — | WO | disclosed |
| CN-111032715-A | Thermoplastic resin composition and molded article with reduced impact noise | 大科能宇菱通株式会社 | 2020-04-17 | — | — | CN | disclosed |
| US-10189982-B2 | Contacting component and structure containing said contacting component | TECHNO POLYMER CO., LTD. (JP) | 2019-01-29 | — | — | US | disclosed |
| US-20170198128-A1 | CONTACTING COMPONENT AND STRUCTURE CONTAINING SAID CONTACTING COMPONENT | TECHNO POLYMER CO., LTD. (JP) | 2017-07-13 | — | — | US | disclosed |
| EP-2985314-A1 | CONTACTING COMPONENT AND STRUCTURE CONTAINING SAID CONTACTING COMPONENT | Techno Polymer Co., Ltd. (JP) | 2016-02-17 | — | — | EP | disclosed |