SCHEMBL17530145

SCHEMBL17530145

COCCO[Si](C)(C)CCCOCC1CO1

nearest known ligand 0.55

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.55
SMN1; SMN2 Q16637 1/20 0.53
ALDH1A1 P00352 4/20 0.50
TDP1 Q9NUW8 1/20 0.50
MAPK1 P28482 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12311054 0.90 TSHR (0.59) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL2231895 0.87 TSHR (0.55) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL2231311 0.87 TSHR (0.55) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL2551784 0.87 SMN1; SMN2 (0.62) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL153462 0.85 SMN1; SMN2 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL125938 0.84 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL16491483 0.84 TSHR (0.45) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL9328949 0.84 TSHR (0.52) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL17530160 0.83 SMN1; SMN2 (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL329863 0.82 TSHR (0.63) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023171514-A1 LAMINATE AND PACKAGING MATERIAL DIC株式会社 2023-09-14 WO disclosed
CN-111117157-B High-temperature-resistant hydrolysis-resistant epoxy resin matrix for sucker rod 道生天合材料科技(上海)股份有限公司 2022-06-24 CN disclosed
EP-2990433-B1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DAINIPPON INK & CHEMICALS (JP) 2022-03-09 EP disclosed
US-9923243-B2 Silicone epoxy ether compositions, methods for making same and uses therefor MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-03-20 US disclosed
US-20160137879-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC CORPORATION (JP) 2016-05-19 US disclosed
EP-2990433-A1 INORGANIC FINE PARTICLE COMPOSITE BODY, METHOD FOR PRODUCING SAME, COMPOSITION AND CURED PRODUCT DIC Corporation (JP) 2016-03-02 EP disclosed