⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5242657 | 0.81 | — | — | |
| SCHEMBL3261130 | 0.79 | — | — | |
| SCHEMBL3417765 | 0.77 | — | — | |
| SCHEMBL2260364 | 0.75 | — | — | |
| SCHEMBL27799573 | 0.75 | — | — | |
| SCHEMBL27003113 | 0.75 | — | — | |
| SCHEMBL28031066 | 0.75 | — | — | |
| SCHEMBL11595824 | 0.75 | — | — | |
| SCHEMBL27653555 | 0.74 | — | — | |
| SCHEMBL2352748 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6830816-B2 | For preparing lacquer | DEGUSSA AG (DE) | 2004-12-14 | — | — | US | claimed |
| US-20030008974-A1 | Highly filled, pasty, composition containing silicoorganic nanohybrid and/or microhybrid capsules for scratch-resistant and/or abrasion-resistant coatings | DEGUSSA AG (DE) | 2003-01-09 | — | — | US | claimed |
| US-12428507-B2 | Polyolefin compositions for photovoltaic encapsulant films | DOW GLOBAL TECHNOLOGIES LLC (US) | 2025-09-30 | — | — | US | disclosed |
| EP-3645619-B1 | POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2025-04-09 | — | — | EP | disclosed |
| US-20240279437-A1 | POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2024-08-22 | — | — | US | disclosed |
| US-11667735-B2 | Polyolefin composition | DOW GLOBAL TECHNOLOGIES LLC (US) | 2023-06-06 | — | — | US | disclosed |
| US-11459411-B2 | Polyolefin composition | DOW GLOBAL TECHNOLOGIES LLC (US) | 2022-10-04 | — | — | US | disclosed |
| US-20220098337-A1 | POLYOLEFIN COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2022-03-31 | — | — | US | disclosed |
| US-20200199340-A1 | POLYOLEFIN COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC | 2020-06-25 | — | — | US | disclosed |
| EP-3645617-A1 | POLYOLEFIN COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-05-06 | — | — | EP | disclosed |
| EP-3645619-A1 | POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2020-05-06 | — | — | EP | disclosed |
| WO-2019000311-A1 | POLYOLEFIN COMPOSITION | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-01-03 | — | — | WO | disclosed |
| WO-2019000744-A1 | POLYOLEFIN COMPOSITIONS FOR PHOTOVOLTAIC ENCAPSULANT FILMS | DOW GLOBAL TECHNOLOGIES LLC (US) | 2019-01-03 | — | — | WO | disclosed |
| US-20110104505-A1 | LAMINATED BODY AND CIRCUIT WIRING BOARD | SULFUR CHEMICAL LABORATORY INCORPORATED (JP) | 2011-05-05 | — | — | US | disclosed |
| EP-1298176-B1 | Stacked film insulating film and substrate for semiconductor | JSR CORP (JP) | 2007-01-03 | — | — | EP | disclosed |
| US-6830816-B2 | For preparing lacquer | DEGUSSA AG (DE) | 2004-12-14 | — | — | US | disclosed |
| US-6824833-B2 | STACKED DIELECTRIC | JSR CORPORATION (JP) | 2004-11-30 | — | — | US | disclosed |
| US-20030077461-A1 | Stacked film, insulating film and substrate for semiconductor | JSR CORPORATION (JP) | 2003-04-24 | — | — | US | disclosed |
| EP-1298176-A2 | Stacked film insulating film and substrate for semiconductor | JSR Corporation (JP) | 2003-04-02 | — | — | EP | disclosed |
| US-20030008974-A1 | Highly filled, pasty, composition containing silicoorganic nanohybrid and/or microhybrid capsules for scratch-resistant and/or abrasion-resistant coatings | DEGUSSA AG (DE) | 2003-01-09 | — | — | US | disclosed |