Methyl Alcohol

Methyl Alcohol

SCHEMBL1758729

CO.CO.CO.CO.CO

nearest known ligand 1.00 ✓ in ChEMBL — recovers established targets

Full drug profile on Sugi Atlas →

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 1.00

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methyl Alcohol SCHEMBL83841 1.00
Methyl Alcohol SCHEMBL9874757 1.00 TSHR (1.00) TSHR
Methyl Alcohol SCHEMBL11044850 1.00 TSHR (1.00) TSHR
Methyl Alcohol SCHEMBL9462322 1.00
Methyl Alcohol SCHEMBL16187030 1.00
Methyl Alcohol SCHEMBL6906274 1.00
Methyl Alcohol SCHEMBL9399881 1.00 TSHR (1.00) TSHR
Methyl Alcohol SCHEMBL12974204 1.00
Methyl Alcohol SCHEMBL37 1.00
Methyl Alcohol SCHEMBL29912539 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2496584-A1 PROCESS FOR THE PREPARATION OF IMIDAZO[2,1-B][1,3]BENZOTHIAZOLE DERIVATIVES Ambit Biosciences Corp. (US) 2012-09-12 EP disclosed
WO-2011056939-A1 PROCESS FOR THE PREPARATION OF IMIDAZO[2,1-B][1,3]BENZOTHIAZOLE DERIVATIVES AMBIT BIOSCIENCES CORP. (US) 2011-05-12 WO disclosed
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
CN-1094137-C Cellulose formate-containing composition MICHELIN RECH TECH (CH) 2002-11-13 CN disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
CN-1122143-A Cellulose formate containing composition for forming a resilient heat-convertible gel MICHELIN RECH TECH (CH) 1996-05-08 CN disclosed
US-4210566-A BLEND OF SOLVENTS, COLORANT, BINDER, AND ELECTROLYTE AMERICAN CAN COMPANY (US) 1980-07-01 US disclosed