SCHEMBL176382

SCHEMBL176382

[Ag].[Cu]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29873070 1.00
SCHEMBL15346383 1.00
SCHEMBL30686738 1.00
SCHEMBL28328246 1.00
SCHEMBL8502732 1.00
SCHEMBL25373886 1.00
SCHEMBL20446652 0.82
SCHEMBL7739004 0.82
SCHEMBL5158183 0.82
SCHEMBL17041882 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 16175 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121566822-B Structure for improving heat dissipation capacity of damping strip of laminated magnetic pole synchronous motor, assembly method and laminated magnetic pole synchronous motor JIAMUSI ELECTRIC MACHINE Co.,Ltd. (CN) 2026-05-26 CN claimed
CN-122094230-A Solar cell and photovoltaic module 2026-05-26 CN claimed
CN-122077257-A Low-stress active metal brazing paste for AMB ceramic copper-clad plate and preparation method thereof 2026-05-26 CN claimed
CN-224288219-U Fuse structure of full-range protection fuse XI'AN HONGFA ELECTRIC APPLIANCE Co.,Ltd. (CN) 2026-05-26 CN claimed
CN-122082007-A Preparation method and application of copper-silver electrocatalyst for preparing ethylene oxide 2026-05-26 CN claimed
CN-224288218-U Fuse structure and high arc extinguishing ability fuse XI'AN HONGFA ELECTRIC APPLIANCE Co.,Ltd. (CN) 2026-05-26 CN claimed
WO-2026103185-A1 TANDEM SOLAR CELL AND PREPARATION METHOD 天合光能股份有限公司 2026-05-21 WO claimed
US-20260139395-A1 Electrolyzer Column THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2026-05-21 US claimed
CN-122067836-A Low-temperature curing high-conductivity copper-silver composite conductive paste and preparation method thereof 杭州正银电子材料有限公司 2026-05-19 CN claimed
CN-122069939-A Skutterudite thermoelectric device and preparation method thereof 中国原子能科学研究院 2026-05-19 CN claimed
EP-0071771-B1 IMPROVED METAL BONDED DIAMOND AGGREGATE ABRASIVE GENERAL ELECTRIC COMPANY (US) 1985-04-10 EP claimed
EP-0129314-A2 Bonding metal to ceramic STC PLC (GB) 1984-12-27 EP claimed
EP-0127377-A2 Button board chip interconnection system TRW INC. (US) 1984-12-05 EP claimed
US-4446502-A BRAZING BOND BETWEEN CAPACITOR AND LEADS U.S. PHILIPS CORPORATION (US) 1984-05-01 US claimed
US-4439768-A RADIATION PROTECTION DEVICES IN MEDICAL AND COMMUNICATIONS FIELDS BAYER AKTIENGESELLSCHAFT (DE) 1984-03-27 US claimed
EP-0071771-A1 Improved metal bonded diamond aggregate abrasive GENERAL ELECTRIC COMPANY (US) 1983-02-16 EP claimed
US-4275046-A BY REACTION OF A METAL OXIDE WITH A FLUOROCARBON VAPOR EXXON RESEARCH & ENGINEERING CO. (US) 1981-06-23 US claimed
US-4208629-A Static electricity indicator BALL CORPORATION (US) 1980-06-17 US claimed
EP-0001179-A1 A process for producing an organic compound by extrusion of sulfur from sulfur containing organic compounds THE STANDARD OIL COMPANY (US) 1979-03-21 EP claimed
US-3935988-A Process of producing solderable composites containing AgCdO Doduco, Eugen Durrwachter (DT) 1976-02-03 US claimed