SCHEMBL17698476

SCHEMBL17698476

N#COCOc1cccc2ccccc12

nearest known ligand 0.51

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
HTR1B P28222 11/20 0.51
KDM4E B2RXH2 2/20 0.49
KCNA3 P22001 1/20 0.49
ALDH1A1 P00352 1/20 0.49
HPGD P15428 1/20 0.49
TDP1 Q9NUW8 1/20 0.49
HTR1D P28221 3/20 0.47
SLC6A4 P31645 2/20 0.46
HRH1 P35367 1/20 0.46
MEN1 O00255 1/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2C19 P33261 1/20 0.46
KMT2A Q03164 1/20 0.46
NR2E1 Q9Y466 1/20 0.45
OGG1 O15527 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16902842 0.82 HTR1B (0.64) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL11026673 0.78 HTR1B (0.55) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL8974397 0.76 HTR1B (0.56) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL29937036 0.76 HTR1B (0.56) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL10408231 0.75 HTR1B (0.61) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL30725930 0.75 HTR1B (0.46) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL822708 0.75 HTR1B (0.46) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL10499954 0.75 HTR1B (0.60) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL5289923 0.74 HTR1B (0.77) HTR1BKDM4EKCNA3ALDH1A1HPGD
SCHEMBL4951780 0.74 HTR1B (0.62) HTR1BKCNA3TDP1HTR1DSLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3916025-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2023-08-09 EP disclosed
EP-3012276-B1 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION COMPRISING THE COMPOUND, AND HARDENED PRODUCT THEREOF MITSUBISHI GAS CHEMICAL CO (JP) 2023-06-14 EP disclosed
US-20230098357-A1 RESIN COMPOSITION, RESIN SHEET, PREPREG AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
EP-3272782-B1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2023-03-22 EP disclosed
EP-3674346-B1 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2023-01-11 EP disclosed
EP-4094940-A1 RESIN COMPOSITION, RESIN SHEET, PREPREG, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-11-30 EP disclosed
US-11466123-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-10-11 US disclosed
US-20220204695-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-06-30 US disclosed
US-20220098369-A1 DEGRADABLE RESIN COMPOSITION, DEGRADABLE CURED PRODUCT AND DOWNHOLE TOOL FOR DRILLING MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-03-31 US disclosed
EP-3521337-B1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATED SHEET, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL CO (JP) 2022-01-26 EP disclosed
EP-3252101-A1 RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2017-12-06 EP disclosed
US-20170332487-A1 RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-11-16 US disclosed
US-20170231090-A1 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-08-10 US disclosed
EP-3168263-A1 RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2017-05-17 EP disclosed
EP-3103825-A1 RESIN COMPOSITION FOR PRINTED-CIRCUIT BOARD, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED-CIRCUIT BOARD Mitsubishi Gas Chemical Company, Inc. (JP) 2016-12-14 EP disclosed
US-20160345433-A1 RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-11-24 US disclosed
US-20160125972-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-05-05 US disclosed
US-20160115271-A1 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT OF SAID COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2016-04-28 US disclosed
EP-3012276-A1 CYANATE ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT OF SAID COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2016-04-27 EP disclosed
EP-3012294-A1 RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2016-04-27 EP disclosed