Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | ESR1 | P03372 | 1/20 | 0.33 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1772658 | 0.83 | FFAR4 (0.32) | — | |
| SCHEMBL30511093 | 0.83 | FFAR4 (0.32) | — | |
| SCHEMBL6666070 | 0.82 | SMN1; SMN2 (0.32) | SMN1; SMN2 | |
| SCHEMBL5048220 | 0.81 | SMN1; SMN2 (0.33) | SMN1; SMN2 | |
| SCHEMBL21835030 | 0.79 | SMN1; SMN2 (0.30) | SMN1; SMN2 | |
| SCHEMBL1773087 | 0.77 | ESR1 (0.33) | ESR1ESR2 | |
| SCHEMBL5048208 | 0.75 | GLA (0.35) | — | |
| SCHEMBL15727038 | 0.75 | — | — | |
| SCHEMBL10451588 | 0.74 | GLA (0.34) | SMN1; SMN2 | |
| SCHEMBL8174823 | 0.72 | TSHR (0.33) | SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250291248-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2025-09-18 | — | — | US | disclosed |
| US-20200103752-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2020-04-02 | — | — | US | disclosed |
| US-20190278176-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND ELECTRONIC DEVICE | SAMSUNG SDI CO., LTD. (KR) | 2019-09-12 | — | — | US | disclosed |
| US-9709710-B2 | Device including light blocking layer and method of patterning the light blocking layer | SAMSUNG SDI CO., LTD. (KR) | 2017-07-18 | — | — | US | disclosed |
| US-9482943-B2 | Positive photosensitive resin composition, and photosensitive resin film and display device prepared by using the same | CHEIL INDUSTRIES INC. (KR) | 2016-11-01 | — | — | US | disclosed |
| US-9465289-B2 | Photosensitive resin composition for display device insulation film, and display device insulation film and display device using same | CHEIL INDUSTRIES INC. (KR) | 2016-10-11 | — | — | US | disclosed |
| US-20160259095-A1 | Device Including Light Blocking Layer and Method of Patterning the Light Blocking Layer | SAMSUNG SDI CO., LTD. (KR) | 2016-09-08 | — | — | US | disclosed |
| US-9429842-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device | SAMSUNG SDI CO., LTD. (KR) | 2016-08-30 | — | — | US | disclosed |
| US-9405188-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device | SAMSUNG SDI CO., LTD. (KR) | 2016-08-02 | — | — | US | disclosed |
| US-9329475-B2 | Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device | CHEIL INDUSTRIES INC. (KR) | 2016-05-03 | — | — | US | disclosed |
| US-7416822-B2 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| EP-1333050-B1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO (JP) | 2006-12-27 | — | — | EP | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| US-7049371-B2 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2006-05-23 | — | — | US | disclosed |
| US-20040002572-A1 | Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2004-01-01 | — | — | US | disclosed |
| EP-1333050-A1 | MATERIAL FOR INSULATING FILM, COATING VARNISH FOR INSULATING FILM, AND INSULATING FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-08-06 | — | — | EP | disclosed |
| EP-1327653-A1 | HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2003-07-16 | — | — | EP | disclosed |
| US-6518390-B2 | Polybenzoxazole and crosslinking agent | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2003-02-11 | — | — | US | disclosed |
| US-20020013443-A1 | Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2002-01-31 | — | — | US | disclosed |